|
74LVC1G98GW |
74LVC1G98GF |
74LVC1G98GM |
74LVC1G98GN |
74LVC1G98GS |
74LVC1G98GV |
Description |
SPECIALTY LOGIC CIRCUIT, PDSO6, PLASTIC, SOT-363, SC-88, PACKAGE-6 |
SPECIALTY LOGIC CIRCUIT, PDSO6, 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6 |
SPECIALTY LOGIC CIRCUIT, PDSO6, 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 |
SPECIALTY LOGIC CIRCUIT, PDSO6, 0.90 X 1.00 MM, 0.35 MM HEIGHT, SOT-1115, XSON-6 |
SPECIALTY LOGIC CIRCUIT, PDSO6, 1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, XSON-6 |
SPECIALTY LOGIC CIRCUIT, PDSO6, PLASTIC, SOT-457, SC-74, TSOP-6 |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
NXP |
NXP |
NXP |
NXP |
NXP |
NXP |
Parts packaging code |
SOT-363 |
SON |
SON |
SON |
SON |
TSOP |
package instruction |
PLASTIC, SOT-363, SC-88, PACKAGE-6 |
1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6 |
1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 |
0.90 X 1.00 MM, 0.35 MM HEIGHT, SOT-1115, XSON-6 |
1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, XSON-6 |
PLASTIC, SOT-457, SC-74, TSOP-6 |
Contacts |
6 |
6 |
6 |
6 |
6 |
6 |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
series |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
JESD-30 code |
R-PDSO-G6 |
S-PDSO-N6 |
S-PDSO-N6 |
R-PDSO-N6 |
S-PDSO-N6 |
R-PDSO-G6 |
JESD-609 code |
e3 |
e3 |
e3 |
e3 |
e3 |
e3 |
length |
2 mm |
1 mm |
1.45 mm |
1 mm |
1 mm |
2.9 mm |
Logic integrated circuit type |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
1 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
6 |
6 |
6 |
6 |
6 |
6 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
VSON |
VSON |
SON |
VSON |
TSSOP |
Package shape |
RECTANGULAR |
SQUARE |
SQUARE |
RECTANGULAR |
SQUARE |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, VERY THIN PROFILE |
SMALL OUTLINE, VERY THIN PROFILE |
SMALL OUTLINE |
SMALL OUTLINE, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.1 mm |
0.5 mm |
0.5 mm |
0.35 mm |
0.35 mm |
1.1 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
1.65 V |
1.65 V |
1.65 V |
1.65 V |
1.65 V |
1.65 V |
Nominal supply voltage (Vsup) |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
PURE TIN |
TIN |
TIN |
TIN |
TIN |
TIN |
Terminal form |
GULL WING |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
GULL WING |
Terminal pitch |
0.65 mm |
0.35 mm |
0.5 mm |
0.3 mm |
0.35 mm |
0.95 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |
30 |
30 |
30 |
30 |
width |
1.25 mm |
1 mm |
1 mm |
0.9 mm |
1 mm |
1.5 mm |