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CM50DU-24H

Description
IGBT MODULES MEDIUM POWER SWITCHING USE INSULATED TYPE
CategoryDiscrete semiconductor    The transistor   
File Size109KB,4 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
Download Datasheet Parametric View All

CM50DU-24H Overview

IGBT MODULES MEDIUM POWER SWITCHING USE INSULATED TYPE

CM50DU-24H Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMitsubishi
Parts packaging codeMODULE
package instructionMODULE-7
Contacts7
Reach Compliance Codeunknow
ECCN codeEAR99
Shell connectionISOLATED
Maximum collector current (IC)50 A
Collector-emitter maximum voltage1200 V
ConfigurationSERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
Gate-emitter maximum voltage20 V
JESD-30 codeR-XUFM-X7
Number of components2
Number of terminals7
Maximum operating temperature150 °C
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)400 W
Certification statusNot Qualified
surface mountNO
Terminal formUNSPECIFIED
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsMOTOR CONTROL
Transistor component materialsSILICON
Nominal off time (toff)500 ns
Nominal on time (ton)280 ns
VCEsat-Max3.7 V
MITSUBISHI IGBT MODULES
CM50DU-24H
MEDIUM POWER SWITCHING USE
INSULATED TYPE
CM50DU-24H
I
C .....................................................................
50A
V
CES .......................................................
1200V
Insulated Type
2-elements in a pack
APPLICATION
UPS, NC machine, AC-Drive control, Servo, Welders
OUTLINE DRAWING & CIRCUIT DIAGRAM
Dimensions in mm
T
C
measured point
94
7
17
80
±0.25
23
23
2–φ6.5
MOUNTING HOLES
4
E2 G2
24
C2E1
E2
C1
18
G1E1
4 11
48
12
3–M5NUTS
12mm deep
16 2.5
25
2.5 16
13.5
E2 G2
TAB
7.5
4
#110. t=0.5
C2E1
E2
13
CM
C1
G1 E1
30
–0.5
+1
LABEL
21.2
CIRCUIT DIAGRAM
Feb. 2009
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