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AS7C1026B-20TI

Description
Standard SRAM, 64KX16, 20ns, CMOS, PDSO44, 10.20 X 18.40 MM, TSOP2-44
Categorystorage    storage   
File Size113KB,10 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
Download Datasheet Parametric View All

AS7C1026B-20TI Overview

Standard SRAM, 64KX16, 20ns, CMOS, PDSO44, 10.20 X 18.40 MM, TSOP2-44

AS7C1026B-20TI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerALSC [Alliance Semiconductor Corporation]
Parts packaging codeTSOP2
package instructionTSOP2, TSOP44,.46,32
Contacts44
Reach Compliance Codeunknown
ECCN code3A991.B.2.B
Maximum access time20 ns
Other featuresTTL COMPATIBLE INPUTS/OUTPUTS; LOW POWER STANDBY
I/O typeCOMMON
JESD-30 codeR-PDSO-G44
JESD-609 codee0
length18.415 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width16
Number of functions1
Number of terminals44
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP44,.46,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.01 A
Minimum standby current4.5 V
Maximum slew rate0.08 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width10.16 mm
Base Number Matches1
March 2004
®
AS7C1026B
5 V 64K X 16 CMOS SRAM
Features
• Industrial and commercial versions
• Organization: 65,536 words × 16 bits
• Center power and ground pins for low noise
• High speed
- 10/12/15/20 ns address access time
- 5, 6, 7, 8 ns output enable access time
• Low power consumption: ACTIVE
- 605 mW / max @ 10 ns
• TTL-compatible, three-state I/O
• JEDEC standard packaging
• ESD protection
2000 volts
• Latch-up current
200 mA
- 44-pin 400 mil SOJ
- 44-pin TSOP 2-400
Pin arrangement
44-Pin SOJ (400 mil), TSOP 2
A4
A3
A2
A1
A0
CE
I/O0
I/O1
I/O2
I/O3
V
CC
GND
I/O4
I/O5
I/O6
I/O7
WE
A15
A14
A13
A12
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A5
A6
A7
OE
UB
LB
I/O15
I/O14
I/O13
I/O12
GND
V
CC
I/O11
I/O10
I/O9
I/O8
NC
A8
A9
A10
A11
NC
• Low power consumption: STANDBY
- 55 mW / max CMOS I/O
• 6 T 0.18 u CMOS technology
• Easy memory expansion with
CE
,
OE
inputs
Logic block diagram
A0
Row decoder
A1
A2
A3
A4
A5
A6
A7
I/O0–I/O7
I/O8–I/O15
V
CC
I/O
buffer
Control circuit
Column decoder
A8
A9
A10
A12
A13
A14
A15
A11
WE
UB
OE
LB
CE
Selection guide
-10
Maximum address access time
Maximum output enable access time
Maximum operating current
Maximum CMOS standby current
-12
12
6
100
10
-15
15
7
90
10
AS7C1026B
64 K × 16
Array
GND
-20
20
8
80
10
Unit
ns
ns
mA
mA
10
5
110
10
3/26/04, v 1.3
Alliance Semiconductor
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Copyright © Alliance Semiconductor. All rights reserved.
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