N74S134F datasheet, PDF - EEWORLD Datasheet

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N74S134F: DescriptionNAND Gate, TTL, CDIP16; Categorylogic logic; File Size167KB，4 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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N74S134F Overview

NAND Gate, TTL, CDIP16

N74S134F Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Logic integrated circuit type	NAND GATE
MaximumI(ol)	0.02 A
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Maximum supply current (ICC)	10 mA
Prop。Delay @ Nom-Sup	7.5 ns
Certification status	Not Qualified
Schmitt trigger	NO
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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N74S134F Related Products

	N74S134F	N74S134FB	N74S134B	S54S134F/883C	S54S134F/883B
Description	NAND Gate, TTL, CDIP16	NAND Gate, TTL, CDIP16	NAND Gate, TTL, PDIP16	NAND Gate, TTL, CDIP16	NAND Gate, TTL, CDIP16
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE
MaximumI(ol)	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A
Number of terminals	16	16	16	16	16
Maximum operating temperature	70 °C	70 °C	70 °C	125 °C	125 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V
Maximum supply current (ICC)	10 mA	10 mA	10 mA	10 mA	10 mA
Prop。Delay @ Nom-Sup	7.5 ns	7.5 ns	7.5 ns	7.5 ns	7.5 ns
Schmitt trigger	NO	NO	NO	NO	NO
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Base Number Matches	1	1	1	-	-

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