20 A, 25 V, 0.0057 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252
Parameter Name | Attribute value |
Brand Name | Fairchild Semiconductor |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Fairchild |
Parts packaging code | DPAK |
package instruction | ROHS COMPLIANT, DPAK-3 |
Contacts | 3 |
Manufacturer packaging code | TO252 (D-PAK), MOLDED, 3 LEAD,OPTION AA&AB |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Avalanche Energy Efficiency Rating (Eas) | 40 mJ |
Shell connection | DRAIN |
Configuration | SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage | 25 V |
Maximum drain current (Abs) (ID) | 67 A |
Maximum drain current (ID) | 20 A |
Maximum drain-source on-resistance | 0.0057 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code | TO-252 |
JESD-30 code | R-PSSO-G2 |
JESD-609 code | e3 |
Humidity sensitivity level | 1 |
Number of components | 1 |
Number of terminals | 2 |
Operating mode | ENHANCEMENT MODE |
Maximum operating temperature | 175 °C |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 |
Polarity/channel type | N-CHANNEL |
Maximum power dissipation(Abs) | 42 W |
Maximum pulsed drain current (IDM) | 150 A |
Certification status | Not Qualified |
surface mount | YES |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal location | SINGLE |
Maximum time at peak reflow temperature | NOT SPECIFIED |
transistor applications | SWITCHING |
Transistor component materials | SILICON |
Base Number Matches | 1 |
FDD6796A | FDU6796A_F071 | |
---|---|---|
Description | 20 A, 25 V, 0.0057 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252 | 20 A, 25 V, 0.0057 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252 |
Is it Rohs certified? | conform to | conform to |
Maker | Fairchild | Fairchild |
Parts packaging code | DPAK | TO-251AA |
package instruction | ROHS COMPLIANT, DPAK-3 | IN-LINE, R-PSIP-T3 |
Contacts | 3 | 3 |
Reach Compliance Code | not_compliant | unknow |
ECCN code | EAR99 | EAR99 |
Avalanche Energy Efficiency Rating (Eas) | 40 mJ | 40 mJ |
Configuration | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage | 25 V | 25 V |
Maximum drain current (ID) | 20 A | 20 A |
Maximum drain-source on-resistance | 0.0057 Ω | 0.0057 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code | TO-252 | TO-251AA |
JESD-30 code | R-PSSO-G2 | R-PSIP-T3 |
Number of components | 1 | 1 |
Number of terminals | 2 | 3 |
Operating mode | ENHANCEMENT MODE | ENHANCEMENT MODE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE |
Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED |
Polarity/channel type | N-CHANNEL | N-CHANNEL |
Maximum pulsed drain current (IDM) | 150 A | 150 A |
Certification status | Not Qualified | Not Qualified |
surface mount | YES | NO |
Terminal form | GULL WING | THROUGH-HOLE |
Terminal location | SINGLE | SINGLE |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
transistor applications | SWITCHING | SWITCHING |
Transistor component materials | SILICON | SILICON |