Power Bipolar Transistor, 3A I(C), 200V V(BR)CEO, 1-Element, NPN, Silicon, TO-276AA, Ceramic, Metal-Sealed Cofired, 3 Pin, HERMETICALLY SEALED, CERAMIC, SMD0.5, 3 PIN
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
package instruction | HERMETICALLY SEALED, CERAMIC, SMD0.5, 3 PIN |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Shell connection | COLLECTOR |
Maximum collector current (IC) | 3 A |
Collector-emitter maximum voltage | 200 V |
Configuration | SINGLE |
Minimum DC current gain (hFE) | 40 |
JEDEC-95 code | TO-276AA |
JESD-30 code | R-CBCC-N3 |
JESD-609 code | e4 |
Number of components | 1 |
Number of terminals | 3 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | NPN |
Certification status | Not Qualified |
surface mount | YES |
Terminal surface | GOLD |
Terminal form | NO LEAD |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
transistor applications | SWITCHING |
Transistor component materials | SILICON |
Nominal transition frequency (fT) | 20 MHz |
Base Number Matches | 1 |
2N5664SMD05R4 | 2N5664SMD05 | |
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Description | Power Bipolar Transistor, 3A I(C), 200V V(BR)CEO, 1-Element, NPN, Silicon, TO-276AA, Ceramic, Metal-Sealed Cofired, 3 Pin, HERMETICALLY SEALED, CERAMIC, SMD0.5, 3 PIN | Power Bipolar Transistor, 3A I(C), 200V V(BR)CEO, 1-Element, NPN, Silicon, TO-276AA, Ceramic, Metal-Sealed Cofired, 3 Pin, HERMETICALLY SEALED, CERAMIC, SMD0.5, 3 PIN |
Is it Rohs certified? | conform to | incompatible |
package instruction | HERMETICALLY SEALED, CERAMIC, SMD0.5, 3 PIN | HERMETICALLY SEALED, CERAMIC, SMD0.5, 3 PIN |
Reach Compliance Code | compliant | compliant |
ECCN code | EAR99 | EAR99 |
Shell connection | COLLECTOR | COLLECTOR |
Maximum collector current (IC) | 3 A | 3 A |
Collector-emitter maximum voltage | 200 V | 200 V |
Configuration | SINGLE | SINGLE |
Minimum DC current gain (hFE) | 40 | 40 |
JEDEC-95 code | TO-276AA | TO-276AA |
JESD-30 code | R-CBCC-N3 | R-CBCC-N3 |
Number of components | 1 | 1 |
Number of terminals | 3 | 3 |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
Polarity/channel type | NPN | NPN |
Certification status | Not Qualified | Not Qualified |
surface mount | YES | YES |
Terminal form | NO LEAD | NO LEAD |
Terminal location | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
transistor applications | SWITCHING | SWITCHING |
Transistor component materials | SILICON | SILICON |
Nominal transition frequency (fT) | 20 MHz | 20 MHz |
Base Number Matches | 1 | 1 |