TSI320-G133CE datasheet, PDF - EEWORLD Datasheet

TSI320-G133CE: DescriptionPCI Bus Controller, CMOS, PBGA352, 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAL-2, BGA-352; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，424 Pages; ManufacturerTundra Semiconductor Corp

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TSI320-G133CE Overview

PCI Bus Controller, CMOS, PBGA352, 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAL-2, BGA-352

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAL-2, BGA-352
Reach Compliance Code	unknown
Address bus width	64
maximum clock frequency	66 MHz
External data bus width	64
JESD-30 code	S-PBGA-B352
JESD-609 code	e0
length	27 mm
Number of terminals	352
Package body material	PLASTIC/EPOXY
encapsulated code	HBGA
Encapsulate equivalent code	BGA352,20X20,50
Package shape	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG
power supply	1.2,3.3 V
Certification status	Not Qualified
Maximum seat height	2.4 mm
Maximum slew rate	0.08 mA
Maximum supply voltage	1.32 V
Minimum supply voltage	1.08 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	27 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, PCI
Base Number Matches	1

TitlePage 80A600B_MA001_05

Tsi320

™

Dual-Mode PCI-to-PCI Bus Bridge

User Manual

Document Number: 80A600B_MA001_05

Document Status: Preliminary

Release Date: March 2002

This document discusses the features, capabilities, and

configuration requirements of the Tsi320. It is intended for hardware

and software engineers who are designing system interconnect

applications with the Tsi320.

Tundra Semiconductor Corporation

	TSI320-G133CE	TSI320-G133IE
Description	PCI Bus Controller, CMOS, PBGA352, 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAL-2, BGA-352	PCI Bus Controller, CMOS, PBGA352, 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAL-2, BGA-352
Is it Rohs certified?	incompatible	incompatible
package instruction	27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAL-2, BGA-352	27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAL-2, BGA-352
Reach Compliance Code	unknown	unknown
Address bus width	64	64
maximum clock frequency	66 MHz	66 MHz
External data bus width	64	64
JESD-30 code	S-PBGA-B352	S-PBGA-B352
JESD-609 code	e0	e0
length	27 mm	27 mm
Number of terminals	352	352
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HBGA	HBGA
Encapsulate equivalent code	BGA352,20X20,50	BGA352,20X20,50
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG
power supply	1.2,3.3 V	1.2,3.3 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	2.4 mm	2.4 mm
Maximum slew rate	0.08 mA	0.08 mA
Maximum supply voltage	1.32 V	1.32 V
Minimum supply voltage	1.08 V	1.08 V
Nominal supply voltage	1.2 V	1.2 V
surface mount	YES	YES
technology	CMOS	CMOS
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM
width	27 mm	27 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, PCI	BUS CONTROLLER, PCI

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

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