HMTMS-120-53-S-D-230 datasheet, PDF

Datasheet> All Categories > The connector> The connector> HMTMS-120-53-S-D-230

HMTMS-120-53-S-D-230: DescriptionBoard Stacking Connector, 40 Contact(s), 2 Row(s), Male, Straight, Solder Terminal, ROHS COMPLIANT; CategoryThe connector The connector; File Size621KB，1 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/; Environmental Compliance

Download Datasheet Parametric View All

HMTMS-120-53-S-D-230 Overview

Board Stacking Connector, 40 Contact(s), 2 Row(s), Male, Straight, Solder Terminal, ROHS COMPLIANT

HMTMS-120-53-S-D-230 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
package instruction	ROHS COMPLIANT
Reach Compliance Code	compliant
Factory Lead Time	2 weeks
Connector type	BOARD STACKING CONNECTOR
Contact to complete cooperation	GOLD (30) OVER NICKEL (50)
Contact completed and terminated	MATTE TIN OVER NICKEL (50)
Contact point gender	MALE
Contact material	PHOSPHOR BRONZE
DIN compliance	NO
Filter function	NO
IEC compliance	NO
JESD-609 code	e3
MIL compliance	NO
Manufacturer's serial number	HMTMS
Plug information	MULTIPLE MATING PARTS AVAILABLE
Mixed contacts	NO
Installation method	STRAIGHT
Installation type	BOARD
Number of rows loaded	2
Options	GENERAL PURPOSE
Terminal pitch	1.27 mm
Termination type	SOLDER
Total number of contacts	40
Base Number Matches	1

Preview

Download Datasheet

View All

F-209-1

MTMS–125–60–G–D–230

MTMS–110–02–G–D–100

MTMS–130–57–G–S–390

Through

T/H

Hole

MODIFIED HEADER

MTMS, HMTMS SERIES

Mates with:

SMS, SLM, RSM

Position anywhere

in the body with

(3,05mm) .120"

minimum tail

SPECIFICATIONS

For complete speciﬁcations

see www.samtec.com?MTMS

or www.samtec.com?HMTMS

Insulator Material:

Black Liquid Crystal

Polymer

Terminal Material:

Phosphor Bronze

Plating:

Au or Sn over

50µ” (1,27µm) Ni

Current Rating:

Operating Temp Range:

-55°C to + 105°C with Tin

-55°C to + 125°C with Gold

RoHS Compliant:

Yes

Board Stacking

BO AR D

SP AC E

OV ER AL L

PI N

(O AL )

PO ST

M AX

IN SE RT IO N

DE PT H

SO CK ET

PR OF ILE

BO DY

PR OF ILE

Ideal for board

stacking

applications

Single row

and double row

TA IL

Note:

Other Gold plating

options available.

Contact Samtec.

TYPE

STRIP

NO. PINS

PER ROW

LEAD

STYLE

Specify

LEAD

STYLE

from

chart

PLATING

OPTION

ROW

OPTION

POST

HEIGHT

OPTION

Note:

This Series is

non-standard, non-returnable.

Processing:

Max Processing Temp:

230°C for 60 seconds, or

260°C for 20 seconds 3x

Lead-Free Solderable:

Yes

thru

MTMS

= Modiﬁed Standard

–G

= 10µ" (0,25µm)

Gold on post,

Gold ﬂash on tail

–S

= Single

Row

–“XXX”

= “B”

Dimension

(Specify

Post Height

in inches

(0,13mm)

.005"

increments)

–“XXX”

= Polarized

Position

(Specify

position of

omitted pin)

–D

= Double

Row

–S

= 30µ" (0,76µm)

Gold on post,

Matte Tin on tail

HMTMS

= Modiﬁed High Temp

(1,27) .050 x No. of Positions

(2,48)

.098

100

LEAD

STYLE

–01

–02

–25*

–51

–52

–53

–54

–55

–56

–57

–58

–59

–60

OAL

(Maximum

when C =

.120 (3,05) )

(11,43) .450 (5,84) .230

(8,13) .320

(8,38) .330

(2,54) .100

(3,18) .125

(10,41) .410 (4,83) .190

(10,80) .425 (5,21) .205

(12,83) .505 (7,24) .285

(14,10) .555 (8,51) .335

(15,49) .610 (9,91) .390

(15,88) .625 (10,29) .405

(16,51) .650 (10,92) .430

(17,91) .705 (12,32) .485

(19,18) .755 (13,59) .535

(20,96) .825 (15,37) .605

(2,54)

.100

(4,98)

.196

HMTMS –D

BODY DESIGN

(0,00) .000

MIN

(2,54)

.100

(0,46) .018 SQ

(1,27) .050 TYP

OAL

(3,05)

.120

MIN

(0,51)

.020

www.samtec.com

(0,51) .020 DIA

Tail DIA is .020" (0,51mm) for min .120" (3,05mm).

Balance of tail is .018" (0,46mm) SQ.

*Style -25 tail C=.105 (2,67) min

is available.

WWW.SAMTEC.COM

Recommended Resources

Automotive integrated circuit regulator circuit

Integrated detection circuit diagram

Infrared receiving circuit diagram with pre-integrated amplifier

γ-ray detection pulse integrating circuit

Frequency offset measurement circuit

Add dimming function to portable battery lamp

Recruiting chip design director/engineer/intern: A technology company in Beijing Recruiting chip design director/engineer/intern positions 1. Responsible for the design of radio frequency, microwave and millimeter wave integrated circuit chips; 2. D...; 小糖人 Recruitment

[Popular Science] The difference between microwave radar sensing and human infrared sensing: [Infrared sensor] The sensing distance is generally 0-5M, the angle is relatively small, and it is greatly affected by the environment, temperature, dust, etc. When it is above 37 degrees, the sensing...; 成都盛瑟传感技术有限公司 Sensor

What is the difference between NFC and Bluetooth?: I remember that NFC and Bluetooth are both short-distance communication technologies. What are the differences between them? NFC stands for Near Field Communication in English. As the name suggests, i...; Jacktang Wireless Connectivity

A brief talk about RISC-V GCC: Linker script learning notes (Part 2): The previous article introduced some link script knowledge. This time we use the CH57x series template project built into MRS (MounRiver Studio) to practice it: 1EntranceENTRY keyword, to make sure th...; Moiiiiilter MCU

Dad’s logic: Buying a car is like finding a partner~~: The car at home has been repaired many times. For safety reasons, I asked my father to change the car. His reply was: buying a car is like dating, you can't do it if you don't like it. The H6 has a sm...; soso Talking

RF Energy Harvesting Technology: There are more and more electronic devices in our daily lives, and they all need some form of power to maintain normal operation. Fortunately, there are many forms of energy around us, which can conve...; Jacktang Wireless Connectivity

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components