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AS8SLC512K32P-10/883C

Description
SRAM Module, 512KX32, 10ns, CMOS, PGA-66
Categorystorage    storage   
File Size186KB,12 Pages
ManufacturerMicross
Websitehttps://www.micross.com
Download Datasheet Parametric View All

AS8SLC512K32P-10/883C Overview

SRAM Module, 512KX32, 10ns, CMOS, PGA-66

AS8SLC512K32P-10/883C Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicross
Parts packaging codePGA
package instructionPGA, PGA66,11X11
Contacts66
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time10 ns
I/O typeCOMMON
JESD-30 codeS-XPGA-P66
JESD-609 codee0
length27.305 mm
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals66
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX32
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Filter levelMIL-STD-883 Class C
Maximum seat height4.5974 mm
Maximum standby current0.08 A
Minimum standby current3 V
Maximum slew rate0.35 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
width27.305 mm
Base Number Matches1
SRAM
AS8SLC512K32
512K x 32 SRAM
SRAM Memory Array MCM
FEATURES
Fast access times: 10, 12, 15, 17 and 20ns
Fast OE\ access times: 6ns
Ultra-low operating power < 1W worst case
Single +3.3V ±0.3V power supply
Fully static -- no clock or timing strobes necessary
All inputs and outputs are TTL-compatible
Easy memory expansion with CE\ and OE\ options
Automatic CE\ power down
High-performance, low-power consumption, CMOS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
GND
I/O 8
I/O 9
I/O 10
I/O 11
I/O 12
I/O 13
I/O 14
I/O 15
PIN ASSIGNMENT
(Top View)
68 Lead CQFP (Q & Q1)
9
10
NC
A0
A1
A2
A3
A4
A5
CE\3
GND
CE\4
WE\1
A6
A7
A8
A9
A10
Vcc
8
7 6
5
4 3
2 1 68 67 66 65 64 63 62 61
60
59
11
58
12
57
13
56
14
55
15
54
16
53
17
52
18
51
19
50
20
49
21
48
22
47
23
46
24
45
25
44
26
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
I/O 16
I/O 17
I/O 18
I/O 19
I/O 20
I/O 21
I/O 22
I/O 23
GND
I/O 24
I/O 25
I/O 26
I/O 27
I/O 28
I/O 29
I/O 30
I/O 31
Timing
10ns
12ns
15ns
17ns
20ns
-10
-12
-15
-17
-20
CS
Vcc
A11
A12
A13
A14
A15
A16
CE\1
OE
CE\2
A17
WE\2
WE\3
WE\4
A18
NC
NC
OPTIONS
MARKINGS
66 Lead PGA (P)
CS
Package
Ceramic Quad Flatpack
Q
Ceramic Quad Flatpak(.054min SO) Q1
Pin Grid Array
P
Operating Temperature Ranges
Military (-55
o
C to +125
o
C)
Industrial (-40
o
C to +85
o
C)
2V data retention/low power
No. 702
No.904
CS
\
CS
XT
IT
L
GENERAL DESCRIPTION
The AS8SLC512K32 is a 3.3V 16 Megabit CMOS SRAM
Module organized as 512Kx32 bits. The AS8SLC512K32 achieves
very high speed access, low powerconsumption and high reliability
by employing advanced CMOS memory technology.
This military temperature grade product is ideally suited for
commercial, industrial, and military applications when asynchronous
high speed switching and low ACTIVE opening power & ultra Fast
Asynchronous Access is mandated.
M4
M3
M2
M1
For more products and information
please visit our web site at
www.micross.com
BLOCK DIAGRAM
AS8SLC512K32
Rev. 2.6 01/10
Micross Components reserves the right to change products or specifications without notice.
1

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