UVPROM, 32KX8, 450ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Intel |
Parts packaging code | DIP |
package instruction | WDIP, DIP28,.6 |
Contacts | 28 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 450 ns |
I/O type | COMMON |
JESD-30 code | R-GDIP-T28 |
JESD-609 code | e0 |
length | 37.084 mm |
memory density | 262144 bit |
Memory IC Type | UVPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | WDIP |
Encapsulate equivalent code | DIP28,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE, WINDOW |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Programming voltage | 12.5 V |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum slew rate | 0.1 mA |
Maximum supply voltage (Vsup) | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | NMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
Base Number Matches | 1 |