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QD27256-4

Description
UVPROM, 32KX8, 450ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
Categorystorage    storage   
File Size397KB,12 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric View All

QD27256-4 Overview

UVPROM, 32KX8, 450ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28

QD27256-4 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIntel
Parts packaging codeDIP
package instructionWDIP, DIP28,.6
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time450 ns
I/O typeCOMMON
JESD-30 codeR-GDIP-T28
JESD-609 codee0
length37.084 mm
memory density262144 bit
Memory IC TypeUVPROM
memory width8
Number of functions1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX8
Output characteristics3-STATE
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeWDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE, WINDOW
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage12.5 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum slew rate0.1 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyNMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
Base Number Matches1

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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