512MX16 FLASH 3V PROM, 35ns, PBGA63, 9.50 X 12 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LFBGA-63
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | STMicroelectronics |
Parts packaging code | BGA |
package instruction | 9.50 X 12 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LFBGA-63 |
Contacts | 63 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.1.A |
Maximum access time | 35 ns |
JESD-30 code | R-PBGA-B63 |
JESD-609 code | e0 |
length | 15 mm |
memory density | 8589934592 bit |
Memory IC Type | FLASH |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 63 |
word count | 536870912 words |
character code | 512000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 3 V |
Certification status | Not Qualified |
Maximum seat height | 1.4 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN LEAD |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
type | NAND TYPE |
width | 8.5 mm |
Base Number Matches | 1 |