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NAND08GW4B2CZC6T

Description
512MX16 FLASH 3V PROM, 35ns, PBGA63, 9.50 X 12 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LFBGA-63
Categorystorage    storage   
File Size1MB,59 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric View All

NAND08GW4B2CZC6T Overview

512MX16 FLASH 3V PROM, 35ns, PBGA63, 9.50 X 12 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LFBGA-63

NAND08GW4B2CZC6T Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeBGA
package instruction9.50 X 12 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LFBGA-63
Contacts63
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time35 ns
JESD-30 codeR-PBGA-B63
JESD-609 codee0
length15 mm
memory density8589934592 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals63
word count536870912 words
character code512000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512MX16
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage3 V
Certification statusNot Qualified
Maximum seat height1.4 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNAND TYPE
width8.5 mm
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