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NLSF308MNR2G

Description
QUAD 2-INPUT AND GATE, QCC16, QFN-16
Categorylogic    logic   
File Size749KB,6 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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NLSF308MNR2G Overview

QUAD 2-INPUT AND GATE, QCC16, QFN-16

NLSF308MNR2G Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
MakerRochester Electronics
Parts packaging codeQFN
package instructionQFN-16
Contacts16
Reach Compliance Codeunknown
JESD-30 codeS-XQCC-N16
JESD-609 codee3
length3 mm
Logic integrated circuit typeAND GATE
Humidity sensitivity levelNOT SPECIFIED
Number of functions4
Number of entries2
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)14 ns
Certification statusCOMMERCIAL
Maximum seat height1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width3 mm
Base Number Matches1
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NLSF308MNR2G Related Products

NLSF308MNR2G NLSF308MNR2
Description QUAD 2-INPUT AND GATE, QCC16, QFN-16 308 SERIES, QUAD 2-INPUT AND GATE, QCC16, QFN-16
Is it lead-free? Contains lead Contains lead
Maker Rochester Electronics Rochester Electronics
Parts packaging code QFN QFN
package instruction QFN-16 QFN-16
Contacts 16 16
Reach Compliance Code unknown unknown
JESD-30 code S-XQCC-N16 S-XQCC-N16
JESD-609 code e3 e0
length 3 mm 3 mm
Logic integrated circuit type AND GATE AND GATE
Humidity sensitivity level NOT SPECIFIED 1
Number of functions 4 4
Number of entries 2 2
Number of terminals 16 16
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code HVQCCN HVQCCN
Package shape SQUARE SQUARE
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 260 235
propagation delay (tpd) 14 ns 14 ns
Certification status COMMERCIAL COMMERCIAL
Maximum seat height 1 mm 1 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2 V 2 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface MATTE TIN TIN LEAD
Terminal form NO LEAD NO LEAD
Terminal pitch 0.5 mm 0.5 mm
Terminal location QUAD QUAD
Maximum time at peak reflow temperature 40 NOT SPECIFIED
width 3 mm 3 mm
Base Number Matches 1 1

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