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EDI8F24128C25MZC

Description
SRAM Module, 384KX8, 25ns, CMOS,
Categorystorage    storage   
File Size247KB,5 Pages
ManufacturerEDI [Electronic devices inc.]
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EDI8F24128C25MZC Overview

SRAM Module, 384KX8, 25ns, CMOS,

EDI8F24128C25MZC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerEDI [Electronic devices inc.]
Reach Compliance Codeunknown
Maximum access time25 ns
Other featuresCONFIGURABLE AS 128K X 24
I/O typeCOMMON
JESD-30 codeR-XZMA-T60
JESD-609 codee0
memory density3145728 bit
Memory IC TypeSRAM MODULE
memory width8
Number of functions1
Number of ports1
Number of terminals60
word count393216 words
character code384000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize384KX8
Output characteristics3-STATE
ExportableYES
Package body materialUNSPECIFIED
encapsulated codeZIP
Encapsulate equivalent codeZIP60,.1,.1
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height14.986 mm
Maximum standby current0.03509 A
Minimum standby current4.5 V
Maximum slew rate0.59 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationZIG-ZAG
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1

EDI8F24128C25MZC Related Products

EDI8F24128C25MZC EDI8F24128C35MZC EDI8F24128C20MZC
Description SRAM Module, 384KX8, 25ns, CMOS, SRAM Module, 384KX8, 35ns, CMOS, SRAM Module, 384KX8, 20ns, CMOS,
Maker EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.]
Reach Compliance Code unknown unknown unknown
Maximum access time 25 ns 35 ns 20 ns
Other features CONFIGURABLE AS 128K X 24 CONFIGURABLE AS 128K X 24 CONFIGURABLE AS 128K X 24
JESD-30 code R-XZMA-T60 R-XZMA-T60 R-XZMA-T60
memory density 3145728 bit 3145728 bit 3145728 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE
memory width 8 8 8
Number of functions 1 1 1
Number of ports 1 1 1
Number of terminals 60 60 60
word count 393216 words 393216 words 393216 words
character code 384000 384000 384000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 384KX8 384KX8 384KX8
Output characteristics 3-STATE 3-STATE 3-STATE
Exportable YES YES YES
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO NO
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal location ZIG-ZAG ZIG-ZAG ZIG-ZAG
Is it Rohs certified? incompatible incompatible -
I/O type COMMON COMMON -
JESD-609 code e0 e0 -
encapsulated code ZIP ZIP -
Encapsulate equivalent code ZIP60,.1,.1 ZIP60,.1,.1 -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED -
power supply 5 V 5 V -
Maximum seat height 14.986 mm 14.986 mm -
Maximum standby current 0.03509 A 0.03509 A -
Minimum standby current 4.5 V 4.5 V -
Maximum slew rate 0.59 mA 0.59 mA -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal pitch 2.54 mm 2.54 mm -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED -
Base Number Matches 1 1 -

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