IC 32-BIT, FLASH, MICROCONTROLLER, BGA108, BGA-108, Microcontroller
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Texas Instruments |
Parts packaging code | BGA |
package instruction | LFBGA, |
Contacts | 108 |
Reach Compliance Code | compliant |
Has ADC | YES |
Address bus width | |
bit size | 32 |
maximum clock frequency | 0.032 MHz |
DAC channel | NO |
DMA channel | YES |
External data bus width | |
JESD-30 code | S-XBGA-B108 |
JESD-609 code | e1 |
length | 10 mm |
Humidity sensitivity level | 3 |
Number of I/O lines | 72 |
Number of terminals | 108 |
Maximum operating temperature | 85 °C |
PWM channel | YES |
Package body material | UNSPECIFIED |
encapsulated code | LFBGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
ROM programmability | FLASH |
Maximum seat height | 1.5 mm |
speed | 80 MHz |
Maximum supply voltage | 1.32 V |
Minimum supply voltage | 1.08 V |
Nominal supply voltage | 1.2 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 10 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
Base Number Matches | 1 |
LM3S5791-IBZ80-C3T | LM3S5791-IQC80-C1 | LM3S5791-IBZ80-C1 | LM3S5791-IBZ80-C1T | LM3S5791-IQC80-C3 | |
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Description | IC 32-BIT, FLASH, MICROCONTROLLER, BGA108, BGA-108, Microcontroller | 32-BIT, FLASH, MICROCONTROLLER, PQFP100, ROHS COMPLIANT, MS-026BED, LQFP-100 | IC 32-BIT, FLASH, MICROCONTROLLER, PBGA108, ROHS COMPLIANT, MO-219F, BGA-108, Microcontroller | IC 32-BIT, FLASH, MICROCONTROLLER, PBGA108, ROHS COMPLIANT, MO-219F, BGA-108, Microcontroller | 32-BIT, FLASH, MICROCONTROLLER, QFP100, LQFP-100 |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to |
Parts packaging code | BGA | QFP | BGA | BGA | QFP |
package instruction | LFBGA, | LFQFP, QFP100,.63SQ,20 | LFBGA, BGA108,12X12,32 | LFBGA, BGA108,12X12,32 | LFQFP, |
Contacts | 108 | 100 | 108 | 108 | 100 |
Reach Compliance Code | compliant | unknown | unknown | unknown | compliant |
Has ADC | YES | YES | YES | YES | YES |
bit size | 32 | 32 | 32 | 32 | 32 |
maximum clock frequency | 0.032 MHz | 0.032 MHz | 0.032 MHz | 0.032 MHz | 0.032 MHz |
DAC channel | NO | NO | NO | NO | NO |
DMA channel | YES | YES | YES | YES | YES |
JESD-30 code | S-XBGA-B108 | S-PQFP-G100 | S-PBGA-B108 | S-PBGA-B108 | S-XQFP-G100 |
length | 10 mm | 14 mm | 10 mm | 10 mm | 14 mm |
Number of I/O lines | 72 | 72 | 72 | 72 | 72 |
Number of terminals | 108 | 100 | 108 | 108 | 100 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
PWM channel | YES | YES | YES | YES | YES |
Package body material | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
encapsulated code | LFBGA | LFQFP | LFBGA | LFBGA | LFQFP |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY | FLATPACK | GRID ARRAY | GRID ARRAY | FLATPACK |
Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM programmability | FLASH | FLASH | FLASH | FLASH | FLASH |
Maximum seat height | 1.5 mm | 1.6 mm | 1.5 mm | 1.5 mm | 1.6 mm |
speed | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
Maximum supply voltage | 1.32 V | 1.32 V | 1.32 V | 1.32 V | 1.32 V |
Minimum supply voltage | 1.08 V | 1.08 V | 1.08 V | 1.08 V | 1.08 V |
Nominal supply voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
surface mount | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | BALL | GULL WING | BALL | BALL | GULL WING |
Terminal pitch | 0.8 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.5 mm |
Terminal location | BOTTOM | QUAD | BOTTOM | BOTTOM | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 10 mm | 14 mm | 10 mm | 10 mm | 14 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Maker | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments |
Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | - |
Encapsulate equivalent code | - | QFP100,.63SQ,20 | BGA108,12X12,32 | BGA108,12X12,32 | - |
power supply | - | 1.2,3.3 V | 1.2,3.3 V | 1.2,3.3 V | - |
RAM (bytes) | - | 65536 | 65536 | 65536 | - |
rom(word) | - | 131072 | 131072 | 131072 | - |