MU-LAW, PCM CODEC, CDIP24, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP24,.6 |
| Reach Compliance Code | unknown |
| Law of compression and extension | MU-LAW |
| filter | NO |
| Maximum gain tolerance | 0.375 dB |
| JESD-30 code | R-GDIP-T24 |
| JESD-609 code | e0 |
| linear encoding | NOT AVAILABLE |
| Negative supply voltage rating | -5 V |
| Number of functions | 1 |
| Number of terminals | 24 |
| Operating mode | SYNCHRONOUS/ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | +-5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.572 mm |
| Maximum slew rate | 8 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Telecom integrated circuit types | PCM CODEC |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| Base Number Matches | 1 |
| TP3020J-1 | TP3021J | TP3021J-1 | |
|---|---|---|---|
| Description | MU-LAW, PCM CODEC, CDIP24, CERAMIC, DIP-24 | A-LAW, PCM CODEC, CDIP22, CERAMIC, DIP-22 | A-LAW, PCM CODEC, CDIP22, CERAMIC, DIP-22 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP24,.6 | DIP, DIP22,.4 | DIP, DIP22,.4 |
| Reach Compliance Code | unknown | unknown | unknown |
| Law of compression and extension | MU-LAW | A-LAW | A-LAW |
| filter | NO | NO | NO |
| Maximum gain tolerance | 0.375 dB | 0.325 dB | 0.375 dB |
| JESD-30 code | R-GDIP-T24 | R-GDIP-T22 | R-GDIP-T22 |
| JESD-609 code | e0 | e0 | e0 |
| linear encoding | NOT AVAILABLE | NOT AVAILABLE | NOT AVAILABLE |
| Negative supply voltage rating | -5 V | -5 V | -5 V |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 24 | 22 | 22 |
| Operating mode | SYNCHRONOUS/ASYNCHRONOUS | SYNCHRONOUS/ASYNCHRONOUS | SYNCHRONOUS/ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.6 | DIP22,.4 | DIP22,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | +-5 V | +-5 V | +-5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.572 mm | 5.715 mm | 5.715 mm |
| Maximum slew rate | 8 mA | 8 mA | 8 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Telecom integrated circuit types | PCM CODEC | PCM CODEC | PCM CODEC |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 10.16 mm | 10.16 mm |
| Base Number Matches | 1 | 1 | 1 |
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