IC 8-BIT, UVPROM, 10 MHz, MICROCONTROLLER, CDIP40, WINDOWED, CERAMIC, DIP-40, Microcontroller
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
package instruction | WDIP, DIP40,.6 |
Reach Compliance Code | unknown |
Has ADC | NO |
Address bus width | |
bit size | 8 |
CPU series | COP800 |
maximum clock frequency | 10 MHz |
DAC channel | NO |
DMA channel | NO |
External data bus width | 8 |
JESD-30 code | R-GDIP-T40 |
JESD-609 code | e0 |
Number of I/O lines | 35 |
Number of terminals | 40 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
PWM channel | YES |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | WDIP |
Encapsulate equivalent code | DIP40,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE, WINDOW |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
RAM (bytes) | 192 |
rom(word) | 8192 |
ROM programmability | UVPROM |
Maximum seat height | 5.715 mm |
speed | 10 MHz |
Maximum slew rate | 25 mA |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
Base Number Matches | 1 |
COP888CGMHD-3 | COP888CGMHEL-3 | COP888CGMHD-1 | COP884CGMHD-1 | COP884CGMHD-3 | COP888CGMHEL-1 | |
---|---|---|---|---|---|---|
Description | IC 8-BIT, UVPROM, 10 MHz, MICROCONTROLLER, CDIP40, WINDOWED, CERAMIC, DIP-40, Microcontroller | IC 8-BIT, UVPROM, 10 MHz, MICROCONTROLLER, PQCC44, WINDOWED, LDCC-44, Microcontroller | IC 8-BIT, UVPROM, 10 MHz, MICROCONTROLLER, CDIP40, WINDOWED, CERAMIC, DIP-40, Microcontroller | IC 8-BIT, UVPROM, 10 MHz, MICROCONTROLLER, CDIP28, WINDOWED, CERAMIC, DIP-28, Microcontroller | IC 8-BIT, UVPROM, 10 MHz, MICROCONTROLLER, CDIP28, WINDOWED, CERAMIC, DIP-28, Microcontroller | IC 8-BIT, UVPROM, 10 MHz, MICROCONTROLLER, PQCC44, WINDOWED, LDCC-44, Microcontroller |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | WDIP, DIP40,.6 | WQCCJ, LDCC44,.7SQ | WDIP, DIP40,.6 | WDIP, DIP28,.6 | WDIP, DIP28,.6 | WQCCJ, LDCC44,.7SQ |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
Has ADC | NO | NO | NO | NO | NO | NO |
bit size | 8 | 8 | 8 | 8 | 8 | 8 |
CPU series | COP800 | COP800 | COP800 | COP800 | COP800 | COP800 |
maximum clock frequency | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
DAC channel | NO | NO | NO | NO | NO | NO |
DMA channel | NO | NO | NO | NO | NO | NO |
External data bus width | 8 | 8 | 8 | 4 | 4 | 8 |
JESD-30 code | R-GDIP-T40 | S-PQCC-J44 | R-GDIP-T40 | R-GDIP-T28 | R-GDIP-T28 | S-PQCC-J44 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Number of I/O lines | 35 | 39 | 35 | 23 | 23 | 39 |
Number of terminals | 40 | 44 | 40 | 28 | 28 | 44 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
PWM channel | YES | YES | YES | YES | YES | YES |
Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
encapsulated code | WDIP | WQCCJ | WDIP | WDIP | WDIP | WQCCJ |
Encapsulate equivalent code | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 | DIP28,.6 | DIP28,.6 | LDCC44,.7SQ |
Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | CHIP CARRIER, WINDOW |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM (bytes) | 192 | 192 | 192 | 192 | 192 | 192 |
rom(word) | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
ROM programmability | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
Maximum seat height | 5.715 mm | 4.27 mm | 5.715 mm | 5.715 mm | 5.715 mm | 4.27 mm |
speed | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
Maximum slew rate | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA |
Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | NO | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 15.24 mm | 16.51 mm | 15.24 mm | 15.24 mm | 15.24 mm | 16.51 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Maker | National Semiconductor(TI ) | - | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |