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WS512K32V-17H1C

Description
SRAM Module, 512KX32, 17ns, CMOS, CPGA66
Categorystorage    storage   
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WS512K32V-17H1C Overview

SRAM Module, 512KX32, 17ns, CMOS, CPGA66

WS512K32V-17H1C Parametric

Parameter NameAttribute value
MakerMicrosemi
package instructionPGA, PGA66,11X11
Reach Compliance Codecompliant
Maximum access time17 ns
I/O typeCOMMON
JESD-30 codeS-XPGA-P66
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of terminals66
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX32
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply3.3 V
Certification statusNot Qualified
Maximum standby current0.2 A
Minimum standby current3 V
Maximum slew rate0.4 mA
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Base Number Matches1
WS512K32V-XXX
512Kx32 SRAM 3.3V MULTICHIP PACKAGE
FEATURES

Access Times of 15, 17, 20ns

Low Voltage Operation

Packaging
• 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic
HIP (Package 400)
• 8 lead, 22.4mm (0.880 inch) CQFP, (G2U), 3.56mm
(0.140"), (Package 510)

Organized as 512Kx32; User Configurable as 2x512Kx16
or 4x512Kx8

Commercial, Industrial and Military Temperature Ranges

Low Voltage Operation:
• 3.3V ± 10% Power Supply

Low Power CMOS
* This product is subject to change without notice.

TTL Compatible Inputs and Outputs

Fully Static Operation:
• No clock or refresh required.

Three State Output.

Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation

Weight
• WS512K32V-XG2UX - 8 grams typical
WS512K32NV-XH1X - 13 grams typical
PIN CONFIGURATION FOR WS512K32NV-XH1X
Top View
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
A
17
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
#
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
A
18
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
WE
4
#
I/O
27
A
3
A
4
A
5
WE
3
#
CS
3
#
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
66
8
8
8
8
WE
1
# CS
1
#
Pin Description
56
I/O
0-31
A
0-18
WE
1-4
#
CS
1-4
#
OE#
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
WE
2
# CS
2
#
WE
3
# CS
3
#
WE
4
# CS
4
#
OE#
A
0-18
512K x 8
512K x 8
512K x 8
512K x 8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
Microsemi Corporation reserves the right to change products or specifications without notice.
November 2010
Rev. 13
© 2010 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com

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