RISC Microprocessor, 1250MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERMIC, HITCE, BGA-360
Parameter Name | Attribute value |
Maker | e2v technologies |
Parts packaging code | BGA |
package instruction | BGA, |
Contacts | 360 |
Reach Compliance Code | compliant |
ECCN code | 3A001.A.3 |
Address bus width | 64 |
boundary scan | YES |
maximum clock frequency | 1250 MHz |
External data bus width | 36 |
Format | FLOATING POINT |
Integrated cache | YES |
JESD-30 code | S-CBGA-B360 |
length | 25 mm |
low power mode | NO |
Number of terminals | 360 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Certification status | Not Qualified |
Maximum seat height | 2.8 mm |
speed | 1250 MHz |
Maximum supply voltage | 1.15 V |
Minimum supply voltage | 1.05 V |
Nominal supply voltage | 1.1 V |
surface mount | YES |
technology | CMOS |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
width | 25 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
Base Number Matches | 1 |