IC 2M X 36 FAST PAGE DRAM MODULE, 70 ns, SMA72, SIMM-72, Dynamic RAM
| Parameter Name | Attribute value |
| Maker | Toshiba Semiconductor |
| Parts packaging code | SIMM |
| Contacts | 72 |
| Reach Compliance Code | unknown |
| access mode | FAST PAGE |
| Maximum access time | 70 ns |
| Other features | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
| Spare memory width | 18 |
| JESD-30 code | R-XSMA-N72 |
| memory density | 75497472 bit |
| Memory IC Type | FAST PAGE DRAM MODULE |
| memory width | 36 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 72 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2MX36 |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Certification status | Not Qualified |
| refresh cycle | 1024 |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal location | SINGLE |
| Base Number Matches | 1 |
| THM3620C0ASG-70 | THM3620C0AS-70 | THM3620C0ASG-80 | THM3620C0AS-80 | |
|---|---|---|---|---|
| Description | IC 2M X 36 FAST PAGE DRAM MODULE, 70 ns, SMA72, SIMM-72, Dynamic RAM | IC 2M X 36 FAST PAGE DRAM MODULE, 70 ns, SMA72, SIMM-72, Dynamic RAM | IC 2M X 36 FAST PAGE DRAM MODULE, 80 ns, SMA72, SIMM-72, Dynamic RAM | IC 2M X 36 FAST PAGE DRAM MODULE, 80 ns, SMA72, SIMM-72, Dynamic RAM |
| Maker | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor |
| Parts packaging code | SIMM | SIMM | SIMM | SIMM |
| Contacts | 72 | 72 | 72 | 72 |
| Reach Compliance Code | unknown | unknown | unknow | unknow |
| access mode | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| Maximum access time | 70 ns | 70 ns | 80 ns | 80 ns |
| Other features | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
| Spare memory width | 18 | 18 | 18 | 18 |
| JESD-30 code | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 |
| memory density | 75497472 bit | 75497472 bit | 75497472 bi | 75497472 bi |
| Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| memory width | 36 | 36 | 36 | 36 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 |
| Number of terminals | 72 | 72 | 72 | 72 |
| word count | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| character code | 2000000 | 2000000 | 2000000 | 2000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 2MX36 | 2MX36 | 2MX36 | 2MX36 |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 1024 | 1024 | 1024 | 1024 |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE |
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