Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PQFP100
| Parameter Name | Attribute value |
| package instruction | QFP, TQFP100,.63SQ |
| Reach Compliance Code | unknown |
| bit size | 8 |
| JESD-30 code | S-PQFP-G100 |
| Number of terminals | 100 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -30 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | TQFP100,.63SQ |
| Package shape | SQUARE |
| Package form | FLATPACK |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 2048 |
| rom(word) | 73728 |
| ROM programmability | MROM |
| speed | 10 MHz |
| Maximum slew rate | 31 mA |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| LC877472C(100TQFP) | LC877478C(100TQFP) | LC877478C(100EQIP) | LC877472C(100EQIP) | LC877464C(100TQFP) | LC877464C(100EQIP) | |
|---|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PQFP100 | Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PQFP100 | Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PQFP100 | Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PQFP100 | Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PQFP100 | Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PQFP100 |
| package instruction | QFP, TQFP100,.63SQ | QFP, TQFP100,.63SQ | QFP, QFP100,.7X.9 | QFP, QFP100,.7X.9 | QFP, TQFP100,.63SQ | QFP, QFP100,.7X.9 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 code | S-PQFP-G100 | S-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | S-PQFP-G100 | R-PQFP-G100 |
| Number of terminals | 100 | 100 | 100 | 100 | 100 | 100 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | QFP | QFP | QFP | QFP | QFP |
| Encapsulate equivalent code | TQFP100,.63SQ | TQFP100,.63SQ | QFP100,.7X.9 | QFP100,.7X.9 | TQFP100,.63SQ | QFP100,.7X.9 |
| Package shape | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| power supply | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 |
| rom(word) | 73728 | 81920 | 81920 | 73728 | 65536 | 65536 |
| ROM programmability | MROM | MROM | MROM | MROM | MROM | MROM |
| speed | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| Maximum slew rate | 31 mA | 31 mA | 31 mA | 31 mA | 31 mA | 31 mA |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.635 mm | 0.635 mm | 0.5 mm | 0.635 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
| Maker | - | SANYO | SANYO | - | SANYO | SANYO |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD