UM9415SME3 datasheet, PDF - EEWORLD Datasheet

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UM9415SME3: DescriptionPin Diode, Silicon, SURFACE MOUNT PACKAGE-2; CategoryDiscrete semiconductor diode; File Size424KB，11 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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UM9415SME3 Overview

Pin Diode, Silicon, SURFACE MOUNT PACKAGE-2

UM9415SME3 Parametric

Parameter Name	Attribute value
package instruction	O-LELF-R2
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	LOW DISTORTION
application	SWITCHING
Shell connection	ISOLATED
Configuration	SINGLE
Diode component materials	SILICON
Diode type	PIN DIODE
frequency band	HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
JESD-30 code	O-LELF-R2
Number of components	1
Number of terminals	2
Package body material	GLASS
Package shape	ROUND
Package form	LONG FORM
Maximum power dissipation	2.5 W
surface mount	YES
technology	POSITIVE-INTRINSIC-NEGATIVE
Terminal form	WRAP AROUND
Terminal location	END
Base Number Matches	1

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UM9401 / UM9402 / UM9415

COMMERCIAL TWO-WAY RADIO

ANTENNA SWITCH DIODES

DESCRIPTION

Microsemi offers a series of PIN diodes

specifically designed and characterized for

solid state antenna switches in commercial

two-way radios. Antenna switches using the

UM9401 and UM9415 series PIN diodes

provide high isolation, low loss and low

distortion characteristics formerly possible

only with electromechanical relay type

switches.

The UM9401 and the UM9402 diodes can

handle 100 W of transmitter power, while

The UM9415 will handle over 1000 W. The

extensive characterization of these PIN diodes in

antenna switch applications has resulted in

guaranteed low distortion specifications under

transmit and receive conditions. These diodes

also feature low forward bias resistance and high

zero bias impedance which are required for low

loss, high isolation and wide bandwidth antenna

switch performance.

KEY FEATURES

WWW .

Microsemi

High transmitter power

UM9401/UM9402 => 100 W

UM9415

=> 1000 W

Low harmonic distortion

Low third order distortion

High carrier lifetime

Non cavity design

Thermally matched configuration

Low capacitance at 0 V bias

Low conductance at 0 V bias

Compatible with automatic insertion

equipment

IMPORTANT:

For the most current data, consult

MICROSEMI’s

website:

http://www.microsemi.com

ABSOLUTE MAXIMUM RATINGS AT 25º C

(UNLESS OTHERWISE SPECIFIED)

Package

Reverse

Voltage

Average

Power

Dissipation

)

Condition

@ Ir = 10 uA

½ in. total length to 25 C

Contact

C (Package Flange

Temperature

Free Air

UM9401

50 V

5.5 W

UM9402

50 V

UM9415

50 V

10 W

1.5 W

2.5 W

APPLICATIONS/BENEFITS

Isolated stud package available

Surface mount package available

UM9401 / UM9402 / UM9415



2005

Rev. 0, 2005-09-15

Microsemi

Page 1

UM9415SME3 Related Products

	UM9415SME3	UM9402B	UM9402SM	UM9401BE3
Description	Pin Diode, Silicon, SURFACE MOUNT PACKAGE-2	Pin Diode, 50V V(BR), Silicon,	Pin Diode, 50V V(BR), Silicon, SURFACE MOUNT PACKAGE-2	Pin Diode, Silicon,
Reach Compliance Code	compliant	unknown	unknown	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
Other features	LOW DISTORTION	LOW DISTORTION	LOW DISTORTION	LOW DISTORTION
application	SWITCHING	SWITCHING	SWITCHING	SWITCHING
Shell connection	ISOLATED	ISOLATED	ISOLATED	ISOLATED
Configuration	SINGLE	SINGLE	SINGLE	SINGLE
Diode component materials	SILICON	SILICON	SILICON	SILICON
Diode type	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE
frequency band	HIGH FREQUENCY TO ULTRA HIGH FREQUENCY	HIGH FREQUENCY TO ULTRA HIGH FREQUENCY	HIGH FREQUENCY TO ULTRA HIGH FREQUENCY	HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
JESD-30 code	O-LELF-R2	O-XALF-W2	O-LELF-R2	O-XALF-W2
Number of components	1	1	1	1
Number of terminals	2	2	2	2
Package body material	GLASS	UNSPECIFIED	GLASS	UNSPECIFIED
Package shape	ROUND	ROUND	ROUND	ROUND
Package form	LONG FORM	LONG FORM	LONG FORM	LONG FORM
Maximum power dissipation	2.5 W	10 W	10 W	1.5 W
surface mount	YES	NO	YES	NO
technology	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE
Terminal form	WRAP AROUND	WIRE	WRAP AROUND	WIRE
Terminal location	END	AXIAL	END	AXIAL
package instruction	O-LELF-R2	-	SURFACE MOUNT PACKAGE-2	O-XALF-W2

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