Flash, 256KX16, 55ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Parts packaging code | BGA |
package instruction | TFBGA, BGA48,6X8,32 |
Contacts | 48 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum access time | 55 ns |
Other features | BOTTOM BOOT BLOCK |
Spare memory width | 8 |
startup block | BOTTOM |
command user interface | YES |
Data polling | YES |
Durability | 1000000 Write/Erase Cycles |
JESD-30 code | R-PBGA-B48 |
JESD-609 code | e1 |
length | 8.15 mm |
memory density | 4194304 bit |
Memory IC Type | FLASH |
memory width | 16 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of departments/size | 1,2,1,7 |
Number of terminals | 48 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 256KX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Encapsulate equivalent code | BGA48,6X8,32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3.3 V |
Programming voltage | 3 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 1.2 mm |
Department size | 16K,8K,32K,64K |
Maximum standby current | 0.000005 A |
Maximum slew rate | 0.03 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
switch bit | YES |
type | NOR TYPE |
width | 6.15 mm |
Base Number Matches | 1 |