TSPC740AMGS10LE datasheet, PDF

TSPC740AMGS10LE: DescriptionRISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，44 Pages; Manufacturere2v technologies

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TSPC740AMGS10LE Overview

RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360

Parameter Name	Attribute value
Parts packaging code	CGA
package instruction	,
Contacts	360
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	83.3 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-CBGA-B360
low power mode	YES
Number of terminals	360
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
speed	233 MHz
Maximum supply voltage	2.7 V
Minimum supply voltage	2.5 V
Nominal supply voltage	2.6 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	BALL
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC
Base Number Matches	1

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