Field Programmable Gate Array, 1920 CLBs, 300000 Gates, 200MHz, 1920-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LBGA-256
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | BGA |
package instruction | LBGA, BGA256,16X16,40 |
Contacts | 256 |
Reach Compliance Code | compliant |
maximum clock frequency | 200 MHz |
Combined latency of CLB-Max | 0.59 ns |
JESD-30 code | S-PBGA-B256 |
length | 17 mm |
Humidity sensitivity level | 3 |
Configurable number of logic blocks | 1920 |
Equivalent number of gates | 300000 |
Number of entries | 302 |
Number of logical units | 1920 |
Output times | 302 |
Number of terminals | 256 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
organize | 1920 CLBS, 300000 GATES |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Encapsulate equivalent code | BGA256,16X16,40 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 1.8,3.3 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 1.5 mm |
Maximum supply voltage | 1.89 V |
Minimum supply voltage | 1.71 V |
Nominal supply voltage | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 17 mm |
Base Number Matches | 1 |