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AK584096AGP-80

Description
DRAM Module, 4MX8, 80ns, CMOS, SIMM-30
Categorystorage    storage   
File Size77KB,2 Pages
ManufacturerACCUTEK
Websitehttp://www.accutekmicro.com/
Download Datasheet Parametric View All

AK584096AGP-80 Overview

DRAM Module, 4MX8, 80ns, CMOS, SIMM-30

AK584096AGP-80 Parametric

Parameter NameAttribute value
Parts packaging codeSIMM
package instruction,
Contacts30
Reach Compliance Codecompliant
ECCN codeEAR99
access modePAGE
Maximum access time80 ns
Other featuresCAS BEFORE RAS REFRESH
JESD-30 codeR-XSMA-T30
memory density33554432 bit
Memory IC TypeDRAM MODULE
memory width8
Number of functions1
Number of ports1
Number of terminals30
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX8
Output characteristics3-STATE
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Certification statusNot Qualified
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Base Number Matches1
DESCRIPTION
Accutek
Microcircuit
Corporation
AK584096AS / AK584096AG
4,194,304 x 8 Bit CMOS
Dynamic Random Access Memory
Front View
30-Pin SIM
The Accutek AK584096 high density memory module is CMOS
DRAM organized in 4 Meg x 8 bit words. The assembly consists of
eight standard 4 Meg x 1 DRAMs in plastic SOJ packages mounted
on the front side of a printed circuit board. The module can be con-
figured as a leadless 30 pad SIM or a leaded 30 pin SIP. The mod-
ule is only 0.800 inch high (same height as a standard 1 Meg
module) making it ideally suited for applications with low height
restrictions.
The operation of the AK584096 is identical to eight 4 Meg x 1
DRAMs. The data input is tied to the data output and brought out
separately for each device, with common RAS, CAS and WE con-
trol. This common I/O feature dictates the use of early-write cycles
to prevent contention of D and Q. Since the Write-Enable (WE) sig-
nal must always go low before CAS in a write cycle, Read-Write and
Read-Modify-Write operation is not possible.
1
30
30-Pin SIP
1
FEATURES
·
4,194,304 x 8 bit organization
·
Optional 30 Pad leadless SIM (Single In-Line Module) or 30
Pin leaded SIP (Single In-Line Package)
·
JEDEC standard pinout
·
Each device has common D and Q lines with common RAS,
CAS and WE control
·
CAS-before-RAS refresh
·
Power
4.40 Watt Max Active (80 nSEC)
3.75 Watt Max Active (100 nSEC)
44 mW Max Standby
·
Operating free air temperature 0
0
C to 70
0
C
·
Upward compatible with AK5816384
·
Downward compatible with AK58256 and AK581024
PIN NOMENCLATURE
DQ
1
- DQ
8
A
0
- A
10
CAS
RAS
WE
Vcc
Vss
NC
Data In / Data Out
Address Inputs
Column Address Strobe
Row Address Strobe
Write Enable
5v Supply
Ground
No Connect
PIN ASSIGNMENT
PIN #
SYMBOL
PIN #
SYMBOL
FUNCTIONAL DIAGRAM
DQ5
A8
A9
A10
DQ6
WE
Vss
DQ7
NC
DQ8
NC
RAS
NC
NC
Vcc
1
2
3
4
5
6
7
8
9
10
11
Vcc
CAS
DQ1
A0
A1
DQ2
A2
A3
Vss
DQ3
A4
A5
DQ4
A6
A7
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
MODULE OPTIONS
Leadless SIM: AK584096AS
Leaded SIP: AK584096AG
12
13
14
15

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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