Standard SRAM, 256KX1, 25ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | SOJ |
package instruction | SOJ, SOJ24,.34 |
Contacts | 24 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 25 ns |
Other features | POWER-DOWN |
I/O type | SEPARATE |
JESD-30 code | R-PDSO-J24 |
JESD-609 code | e0 |
memory density | 262144 bit |
Memory IC Type | STANDARD SRAM |
memory width | 1 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 24 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX1 |
Output characteristics | 3-STATE |
Exportable | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOJ |
Encapsulate equivalent code | SOJ24,.34 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.01 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 0.12 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Base Number Matches | 1 |
M5M5257AJ-25 | M5M5257AP-25 | M5M5257AP-30 | M5M5257AJ-30 | |
---|---|---|---|---|
Description | Standard SRAM, 256KX1, 25ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | Standard SRAM, 256KX1, 25ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 256KX1, 30ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 256KX1, 30ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | SOJ | DIP | DIP | SOJ |
package instruction | SOJ, SOJ24,.34 | DIP, DIP24,.3 | DIP, DIP24,.3 | SOJ, SOJ24,.34 |
Contacts | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 25 ns | 25 ns | 30 ns | 30 ns |
Other features | POWER-DOWN | POWER-DOWN | POWER-DOWN | POWER-DOWN |
I/O type | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
JESD-30 code | R-PDSO-J24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-J24 |
JESD-609 code | e0 | e0 | e0 | e0 |
memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 1 | 1 | 1 | 1 |
Number of functions | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 |
Number of terminals | 24 | 24 | 24 | 24 |
word count | 262144 words | 262144 words | 262144 words | 262144 words |
character code | 256000 | 256000 | 256000 | 256000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 256KX1 | 256KX1 | 256KX1 | 256KX1 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Exportable | NO | NO | NO | NO |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOJ | DIP | DIP | SOJ |
Encapsulate equivalent code | SOJ24,.34 | DIP24,.3 | DIP24,.3 | SOJ24,.34 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 0.01 A | 0.01 A | 0.01 A | 0.01 A |
Minimum standby current | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Maximum slew rate | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND |
Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Maker | - | Mitsubishi | Mitsubishi | Mitsubishi |