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SMBJ11ATRE3

Description
Trans Voltage Suppressor Diode, 11V V(RWM), Unidirectional,
CategoryDiscrete semiconductor    diode   
File Size182KB,4 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
Download Datasheet Parametric View All

SMBJ11ATRE3 Overview

Trans Voltage Suppressor Diode, 11V V(RWM), Unidirectional,

SMBJ11ATRE3 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Reach Compliance Codecompliant
ECCN codeEAR99
Breakdown voltage nominal value12.85 V
Maximum clamping voltage18.2 V
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
polarityUNIDIRECTIONAL
Maximum repetitive peak reverse voltage11 V
surface mountYES
Base Number Matches1
SMBJ5.0 thru SMBJ170A, CA, e3
and SMBG5.0 thru SMBG170A, CA, e3
SCOTTSDALE DIVISION
SURFACE MOUNT 600 Watt
Transient Voltage Suppressor
DESCRIPTION
This SMBJ5.0-170A or SMBG5.0-170A series of surface mount 600 W
Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive
components from destruction or degradation. It is available in J-bend design
(SMBJ) with the DO-214AA package for greater PC board mounting density or
in a Gull-wing design (SMBG) in the DO-215AA for visible solder connections.
It is also available in both unidirectional and bidirectional configurations with a
C or CA suffix part number as well as RoHS Compliant with an e3 suffix. Their
response time is virtually instantaneous. As a result, they can be used for
protection from ESD or EFT per IEC61000-4-2 and IEC61000-4-4, or for
inductive switching environments and induced RF protection. They can also
protect from secondary lightning effects per IEC61000-4-5 and class levels
defined herein. Microsemi also offers numerous other TVS products to meet
higher and lower power demands and special applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
FEATURES
Available in both unidirectional and bidirectional
construction (add C or CA suffix for bidirectional)
Selections for 5.0 to 170 volts standoff voltages (V
WM
)
Optional 100%
screening for avionics grade
is available
by adding MA prefix to part number for 100% temperature
cycle -55
o
C to +125
o
C (10X) as well as surge (3X) and 24
hours HTRB with post test V
Z
& I
R
(in operating direction
for unidirectional or both directions for bidirectional)
Options for screening in accordance with MIL-PRF-19500
for JAN, JANTX, and JANTXV by adding MQ, MX, or MV
prefixes respectively to part numbers.
Axial-lead equivalent packages for thru-hole mounting
available as P6KE6.8 to P6KE200CA (consult factory for
other surface mount options)
Moisture classification is Level 1 with no dry pack required
per IPC/JEDEC J-STD-020B
RoHS compliant devices available by adding an “e3” suffix
APPLICATIONS / BENEFITS
Economical surface mount design in both J-bend or
Gull-wing terminations
Protects sensitive components such as IC’s, CMOS,
2
Bipolar, BiCMOS, ECL, DTL, T L, etc.
Protection from switching transients & induced RF
Compliant to IEC61000-4-2 and IEC61000-4-4 for
ESD and EFT protection respectively
Secondary lightning protection per IEC61000-4-5 with
42 Ohms source impedance:
Class 1: SMB 5.0 to SMB 120A or CA
Class 2: SMB 5.0 to SMB 60A or CA
Class 3: SMB 5.0 to SMB 30A or CA
Class 4: SMB 5.0 to SMB 15A or CA
Secondary lightning protection per IEC61000-4-5 with
12 Ohms source impedance:
Class 1: SMB 5.0 to SMB 36A or CA
Class 2: SMB 5.0 to SMB 18A or CA
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25
º
C: 600 watts at
10/1000
μs
(also see Fig 1,2, and 3).
Impulse repetition rate (duty factor): 0.01%
t
clamping
(0 volts to
V
(BR)
min.): < 100 ps theoretical for
unidirectional and < 5 ns for bidirectional
Operating and Storage temperature: -65
º
C to +150
º
C
Thermal resistance: 25
º
C/W junction to lead, or 90
º
C/W
junction to ambient when mounted on FR4 PC board (1oz
Cu) with recommended footprint (see last page)
o
Steady-State Power dissipation: 5 watts at T
L
= 25 C, or
1.38 watts at T
A
= 25
º
C when mounted on FR4 PC board
with recommended footprint
Forward Surge at 25ºC: 100 Amps peak impulse of 8.3
ms half-sine wave (unidirectional only)
Solder temperatures: 260
º
C for 10 s (maximum)
Copyright
©
2007
6-20-2007 REV H
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: Gull-wing or C-bend (modified J-bend)
tin-lead or RoHS compliant annealed matte-tin plating
solderable per MIL-STD-750, method 2026
POLARITY: Cathode indicated by band. No marking
on bi-directional devices
MARKING: Part number without standard prefix (e.g.
5.0, 5.0A, 5.0CA, 5.0Ae3, 36, MX36A, 36CAe3, etc.)
TAPE & REEL option: Standard per EIA-481-1-A with
12 mm tape, 750 per 7 inch reel or 2500 per 13 inch
reel (add “TR” suffix to part number)
WEIGHT: 0.1 grams
See package dimension on last page
SMB5.0– 170AC, e3
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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