1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP28, CERAMIC, DIP-28
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Rochester Electronics |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 28 |
Reach Compliance Code | unknown |
Maximum analog input voltage | |
Minimum analog input voltage | -2 V |
Converter type | ADC, FLASH METHOD |
JESD-30 code | R-CDIP-T28 |
JESD-609 code | e0 |
Maximum linear error (EL) | 0.4688% |
Humidity sensitivity level | NOT SPECIFIED |
Nominal negative supply voltage | -5.2 V |
Number of analog input channels | 1 |
Number of digits | 8 |
Number of functions | 1 |
Number of terminals | 28 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output bit code | BINARY |
Output format | PARALLEL, 8 BITS |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Sampling rate | 150 MHz |
Maximum seat height | 5.72 mm |
surface mount | NO |
technology | BIPOLAR |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
Base Number Matches | 1 |
AD9002TD/883B | AD9002SD/883B | AD9002BD | AD9002AJ | AD9002AD | AD9002BJ | |
---|---|---|---|---|---|---|
Description | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP28, CERAMIC, DIP-28 | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP28, CERAMIC, DIP-28 | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP28, CERAMIC, DIP-28 | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CQCC28, CERAMIC, LCC-28 | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP28, CERAMIC, DIP-28 | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CQCC28, CERAMIC, LCC-28 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
Parts packaging code | DIP | DIP | DIP | QLCC | DIP | QLCC |
package instruction | DIP, | DIP, | DIP, | QCCJ, | DIP, | QCCJ, |
Contacts | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
Minimum analog input voltage | -2 V | -2 V | -2 V | -2 V | -2 V | -2 V |
Converter type | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
JESD-30 code | R-CDIP-T28 | R-CDIP-T28 | R-CDIP-T28 | S-CQCC-J28 | R-CDIP-T28 | S-CQCC-J28 |
JESD-609 code | e0 | e0 | e0 | e4 | e0 | e0 |
Maximum linear error (EL) | 0.4688% | 0.4688% | 0.4688% | 0.4688% | 0.4688% | 0.4688% |
Humidity sensitivity level | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT APPLICABLE | NOT SPECIFIED | NOT SPECIFIED |
Nominal negative supply voltage | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
Number of analog input channels | 1 | 1 | 1 | 1 | 1 | 1 |
Number of digits | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 |
Maximum operating temperature | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -55 °C | -55 °C | -25 °C | -25 °C | -25 °C | -25 °C |
Output bit code | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
Output format | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DIP | DIP | QCCJ | DIP | QCCJ |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
Package form | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT APPLICABLE | NOT SPECIFIED | NOT SPECIFIED |
Sampling rate | 150 MHz | 150 MHz | 150 MHz | 150 MHz | 150 MHz | 150 MHz |
Maximum seat height | 5.72 mm | 5.72 mm | 5.72 mm | 3.18 mm | 5.72 mm | 3.18 mm |
surface mount | NO | NO | NO | YES | NO | YES |
technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
Temperature level | MILITARY | MILITARY | OTHER | OTHER | OTHER | OTHER |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | GOLD | TIN LEAD | TIN LEAD |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT APPLICABLE | NOT SPECIFIED | NOT SPECIFIED |
width | 15.24 mm | 15.24 mm | 15.24 mm | 11.43 mm | 15.24 mm | 11.43 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |