FIFO, 4KX9, 50ns, Asynchronous, CMOS, PDIP28
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | _compli |
| ECCN code | EAR99 |
| Maximum access time | 50 ns |
| Maximum clock frequency (fCLK) | 15.4 MHz |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| memory density | 36864 bi |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Humidity sensitivity level | 1 |
| Number of terminals | 28 |
| word count | 4096 words |
| character code | 4000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4KX9 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.002 A |
| Maximum slew rate | 0.14 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 6 |
| Base Number Matches | 1 |
| 5962-01-392-3621 | 72141L35P | 5962-01-406-6020 | 72131L50P | 72141L50P | 72131L35P | |
|---|---|---|---|---|---|---|
| Description | FIFO, 4KX9, 50ns, Asynchronous, CMOS, PDIP28 | PDIP-28, Tube | FIFO, 2KX9, 50ns, Asynchronous, CMOS, PDIP28 | PDIP-28, Tube | PDIP-28, Tube | PDIP-28, Tube |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | _compli | not_compliant | not_compliant | _compli | _compli | _compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 50 ns | 18 ns | 50 ns | 18 ns | 18 ns | 18 ns |
| Maximum clock frequency (fCLK) | 15.4 MHz | 22.2 MHz | 15.4 MHz | 15.4 MHz | 15.4 MHz | 22.2 MHz |
| JESD-30 code | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 36864 bi | 36864 bit | 18432 bit | 18432 bi | 36864 bi | 18432 bi |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 9 | 9 | 9 | 9 | 9 | 9 |
| Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 4096 words | 4096 words | 2048 words | 2048 words | 4096 words | 2048 words |
| character code | 4000 | 4000 | 2000 | 2000 | 4000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 4KX9 | 4KX9 | 2KX9 | 2KX9 | 4KX9 | 2KX9 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 | 245 | 260 | 245 | 245 | 245 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
| Maximum slew rate | 0.14 mA | 0.14 mA | 0.14 mA | 0.14 mA | 0.14 mA | 0.14 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 6 | NOT SPECIFIED | 6 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Brand Name | - | Integrated Device Technology | - | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| Maker | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Parts packaging code | - | PDIP | - | PDIP | PDIP | PDIP |
| package instruction | - | DIP-28 | - | DIP-28 | DIP-28 | DIP-28 |
| Contacts | - | 28 | - | 28 | 28 | 28 |
| Manufacturer packaging code | - | PD28 | - | PD28 | PD28 | PD28 |
| Other features | - | RETRANSMIT | - | RETRANSMIT | RETRANSMIT | RETRANSMIT |
| Number of functions | - | 1 | - | 1 | 1 | 1 |
| Exportable | - | NO | - | NO | NO | NO |
| Parallel/Serial | - | PARALLEL/SERIAL | - | PARALLEL/SERIAL | PARALLEL/SERIAL | PARALLEL/SERIAL |
| Maximum supply voltage (Vsup) | - | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | - | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
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