HM1-6508B-8 datasheet, PDF - EEWORLD Datasheet

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HM1-6508B-8: DescriptionIC,SYNC SRAM,1KX1,CMOS,DIP,16PIN,CERAMIC; Categorystorage storage; File Size242KB，9 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HM1-6508B-8 Overview

IC,SYNC SRAM,1KX1,CMOS,DIP,16PIN,CERAMIC

HM1-6508B-8 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Reach Compliance Code	not_compliant
Maximum access time	180 ns
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
memory density	1024 bit
Memory IC Type	STANDARD SRAM
memory width	1
Number of terminals	16
word count	1024 words
character code	1000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1KX1
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Maximum standby current	0.000005 A
Minimum standby current	2 V
Maximum slew rate	0.008 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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HM1-6508B-8 Related Products

	HM1-6508B-8	HM1-6508-8	HM3-6508-5	HM1-6508-5
Description	IC,SYNC SRAM,1KX1,CMOS,DIP,16PIN,CERAMIC	IC,SYNC SRAM,1KX1,CMOS,DIP,16PIN,CERAMIC	IC,SYNC SRAM,1KX1,CMOS,DIP,16PIN,PLASTIC	IC,SYNC SRAM,1KX1,CMOS,DIP,16PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant
Maximum access time	180 ns	250 ns	310 ns	310 ns
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0
memory density	1024 bit	1024 bit	1024 bit	1024 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	1	1	1	1
Number of terminals	16	16	16	16
word count	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	70 °C	70 °C
organize	1KX1	1KX1	1KX1	1KX1
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.000005 A	0.00001 A	0.0001 A	0.0001 A
Minimum standby current	2 V	2 V	2 V	2 V
Maximum slew rate	0.008 mA	0.007 mA	0.006 mA	0.006 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maker	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation

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