MX29LV065BXBC-12 datasheet, PDF

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MX29LV065BXBC-12: DescriptionFlash, 8MX8, 120ns, PBGA63, 11 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, MO-210, CSP-63; Categorystorage storage; File Size486KB，63 Pages; ManufacturerMacronix; Websitehttp://www.macronix.com/en-us/Pages/default.aspx

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MX29LV065BXBC-12 Overview

Flash, 8MX8, 120ns, PBGA63, 11 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, MO-210, CSP-63

MX29LV065BXBC-12 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	TFBGA, BGA63,8X12,32
Contacts	63
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
Maximum access time	120 ns
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B63
JESD-609 code	e0
length	12 mm
memory density	67108864 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of departments/size	128
Number of terminals	63
word count	8388608 words
character code	8000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA63,8X12,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	64K
Maximum standby current	0.000015 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	YES
type	NOR TYPE
width	11 mm
Base Number Matches	1

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MX29LV065B

64M-BIT [8M x 8] CMOS EQUAL SECTOR FLASH MEMORY

FEATURES

GENERAL FEATURES

• 8,388,608 x 8 byte structure

• One hundred twenty-eight Equal Sectors with 64K byte

each

- Any combination of sectors can be erased with erase

suspend/resume function

• Sector Protection/Chip Unprotected

- Provides sector group protect function to prevent pro

gram or erase operation in the protected sector group

- Provides chip unprotected function to allow code

changing

- Provides temporary sector group unprotected func-

tion for code changing in previously protected sector

groups

• Secured Silicon Sector

- Provides a 128-byte area for code or data that can

be permanently protected.

- Once this sector is protected, it is prohibited to pro-

gram or erase within the sector again.

• Single Power Supply Operation

- 3.0 to 3.6 volt for read, erase, and program opera-

tions

• Latch-up protected to 250mA from -1V to Vcc + 1V

• Low Vcc write inhibit is equal to or less than 2.5V

• Compatible with JEDEC standard

- Pinout and software compatible to single power sup-

ply Flash

PERFORMANCE

• High Performance

- Fast access time: 90/120ns

- Fast program time: 7us, 42s/chip (typical)

- Fast erase time: 0.9s/sector, 45s/chip (typical)

• Low Power Consumption

- Low active read current: 9mA (typical) at 5MHz

- Low standby current: 0.2uA(typ.)

• Minimum 100,000 erase/program cycle

• 20-year data retention

SOFTWARE FEATURES

• Support Common Flash Interface (CFI)

- Flash device parameters stored on the device and

provide the host system to access.

• Erase Suspend/ Erase Resume

- Suspends sector erase operation to read data from

or program data to another sector which is not being

erased

• Status Reply

- Data# Polling & Toggle bits provide detection of pro-

gram and erase operation completion

HARDWARE FEATURES

• Ready/Busy# (RY/BY#) Output

- Provides a hardware method of detecting program

and erase operation completion

• Hardware Reset (RESET#) Input

- Provides a hardware method to reset the internal state

machine to read mode

• ACC pin

- Accelerates programming time for higher throughput

during system production

PACKAGE

• 48-pin TSOP

• 63-ball CSP

GENERAL DESCRIPTION

The MX29LV065B is a 64-mega bit Flash memory orga-

nized as 8M bytes of 8 bits. MXIC's Flash memories

offer the most cost-effective and reliable read/write non-

volatile random access memory. The MX29LV065B is

packaged in 48-pin TSOP and 63-ball CSP. It is designed

to be reprogrammed and erased in system or in standard

EPROM programmers.

The standard MX29LV065B offers access time as fast

as 90ns, allowing operation of high-speed microproces-

sors without wait states. To eliminate bus contention,

the MX29LV065B has separate chip enable (CE#) and

output enable (OE#) controls.

MXIC's Flash memories augment EPROM functionality

P/N:PM1082

REV. 1.0, MAR. 08, 2005

MX29LV065BXBC-12 Related Products

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Description	Flash, 8MX8, 120ns, PBGA63, 11 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, MO-210, CSP-63	Flash, 8MX8, 90ns, PBGA63, 11 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MO-210, CSP-63	Flash, 8MX8, 90ns, PBGA63, 11 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MO-210, CSP-63	Flash, 8MX8, 90ns, PBGA63, 11 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, MO-210, CSP-63	Flash, 8MX8, 90ns, PBGA63, 11 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, MO-210, CSP-63	Flash, 8MX8, 120ns, PBGA63, 11 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, MO-210, CSP-63	Flash, 8MX8, 120ns, PBGA63, 11 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MO-210, CSP-63	Flash, 8MX8, 120ns, PBGA63, 11 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MO-210, CSP-63
Is it Rohs certified?	incompatible	conform to	conform to	incompatible	incompatible	incompatible	conform to	conform to
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	TFBGA, BGA63,8X12,32	TFBGA, BGA63,8X12,32	TFBGA, BGA63,8X12,32	TFBGA, BGA63,8X12,32	TFBGA, BGA63,8X12,32	TFBGA, BGA63,8X12,32	TFBGA, BGA63,8X12,32	TFBGA, BGA63,8X12,32
Contacts	63	63	63	63	63	63	63	63
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum access time	120 ns	90 ns	90 ns	90 ns	90 ns	120 ns	120 ns	120 ns
command user interface	YES	YES	YES	YES	YES	YES	YES	YES
Universal Flash Interface	YES	YES	YES	YES	YES	YES	YES	YES
Data polling	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	R-PBGA-B63	R-PBGA-B63	R-PBGA-B63	R-PBGA-B63	R-PBGA-B63	R-PBGA-B63	R-PBGA-B63	R-PBGA-B63
JESD-609 code	e0	e1	e1	e0	e0	e0	e1	e1
length	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm
memory density	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of departments/size	128	128	128	128	128	128	128	128
Number of terminals	63	63	63	63	63	63	63	63
word count	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words
character code	8000000	8000000	8000000	8000000	8000000	8000000	8000000	8000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C	85 °C	85 °C	85 °C	70 °C
organize	8MX8	8MX8	8MX8	8MX8	8MX8	8MX8	8MX8	8MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Encapsulate equivalent code	BGA63,8X12,32	BGA63,8X12,32	BGA63,8X12,32	BGA63,8X12,32	BGA63,8X12,32	BGA63,8X12,32	BGA63,8X12,32	BGA63,8X12,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	260	260
power supply	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Programming voltage	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES	YES	YES	YES	YES	YES
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Department size	64K	64K	64K	64K	64K	64K	64K	64K
Maximum standby current	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	TIN SILVER COPPER	TIN SILVER COPPER	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	TIN SILVER COPPER	TIN SILVER COPPER
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	40	40	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	40	40
switch bit	YES	YES	YES	YES	YES	YES	YES	YES
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	11 mm	11 mm	11 mm	11 mm	11 mm	11 mm	11 mm	11 mm
Base Number Matches	1	1	1	1	1	-	-	-

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