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According to media reports, Xie Bing, senior vice president of global sales and marketing applications at Texas Instruments (TI), is about to retire. Xie Bing is the only professional manager from th...[Details]
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On March 3, SMIC issued an announcement stating that on February 1, 2021, the company signed a revised and restated ASML Bulk Purchase Agreement with ASML Shanghai, according to which the term of the...[Details]
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On April 10, according to Yonhap News Agency, South Korean President Yoon Seok-yeol stated at the "Semiconductor Field Pending Issues Meeting" held yesterday that the South Korean government plans ...[Details]
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Farnell, the global development distributor of electronic components and services, has announced a new distribution agreement with KOA Europe GmbH, a leading global manufacturer of passive components...[Details]
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The epidemic in Malaysia has re-emerged, and the Malaysian government has decisively imposed a two-week lockdown, requiring local production lines to maintain low-manpower operations and reduce produ...[Details]
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Laser linewidth measurement. Image source: "Nature·Photonics" A team of researchers at Yale University in the United States has developed the first chip-scale titanium-doped sapphire laser, a bre...[Details]
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Xilinx, the computer chip maker that will be acquired by AMD at the end of this year, released its fourth-quarter financial report, with performance exceeding expectations and revenue setting a new r...[Details]
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Guangdong Gowin Semiconductor Technology Co., Ltd. (hereinafter referred to as "Gowin Semiconductor"), the world's fastest growing FPGA supplier, announced that it has granted Rutronik GmbH as its fr...[Details]
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In the first month of 2000, Professor Sergey Savastiou of Santa Clara University published an article titled "Moore's Law – the Z dimension" in the journal Solid State Technology. The title of th...[Details]
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With the global chip shortage showing no signs of abating, IBM and Switzerland-based STMicroelectronics have reportedly chosen not to wait for chips manufactured by TSMC and instead place foundry ord...[Details]
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The progress of Tencent’s self-developed chip research and development was made public for the first time. At the 2021 Tencent Digital Ecosystem Conference, Tencent Senior Executive Vice President...[Details]
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According to news on November 7, although Samsung has been working with AMD over the past few years to bring ray tracing capabilities to its Exynos chips, recent news has revealed that Samsung seems ...[Details]
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TSMC today announced a new process node "N4P" - it looks like 4nm, but it is actually another version of 5nm. To be precise, it is the fourth version after N5, N5P, and N4, and the third upgraded ver...[Details]
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According to the pictures released by "La Bi Lao Xin", automotive chip giant ON Semiconductor sent a price increase letter to its customers on September 10, announcing that it would increase prices f...[Details]
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On October 24, Bloomberg reported yesterday that Arm plans to cancel the license that allows its long-term partner Qualcomm to use Arm intellectual property to design chips.
Today, analy...[Details]