EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

HD74HC08P

Description
Quad. 2-input AND Gates
Categorylogic    logic   
File Size84KB,7 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Environmental Compliance
Download Datasheet Parametric Compare View All

HD74HC08P Overview

Quad. 2-input AND Gates

HD74HC08P Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerRenesas Electronics Corporation
Parts packaging codeDIP
package instructionDIP, DIP14,.3
Contacts14
Reach Compliance Codecompli
ECCN codeEAR99
seriesHC/UH
JESD-30 codeR-PDIP-T14
length19.2 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeAND GATE
MaximumI(ol)0.004 A
Humidity sensitivity level1
Number of functions4
Number of entries2
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2/6 V
Prop。Delay @ Nom-Su23 ns
propagation delay (tpd)115 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height5.06 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)4.5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

HD74HC08P Related Products

HD74HC08P HD74HC08FPEL HD74HC08 HD74HC08RPEL HD74HC08TELL
Description Quad. 2-input AND Gates Quad. 2-input AND Gates Quad. 2-input AND Gates Quad. 2-input AND Gates Quad. 2-input AND Gates
Is it lead-free? Lead free Lead free - Lead free Lead free
Is it Rohs certified? conform to conform to - conform to conform to
Maker Renesas Electronics Corporation Renesas Electronics Corporation - Renesas Electronics Corporation Renesas Electronics Corporation
Parts packaging code DIP SOIC - SOIC TSSOP
package instruction DIP, DIP14,.3 5.50 X 10.06 MM, 1.27 MM PITCH, PLASTIC, SOP-14 - 3.95 X 8.65 MM, 1.27 MM PITCH, PLASTIC, SOP-14 4.4 X 5 MM, 0.65 MM PITCH, PLASTIC, TSSOP-14
Contacts 14 14 - 14 14
Reach Compliance Code compli compli - compliant compliant
ECCN code EAR99 EAR99 - EAR99 EAR99
series HC/UH HC/UH - HC/UH HC/UH
JESD-30 code R-PDIP-T14 R-PDSO-G14 - R-PDSO-G14 R-PDSO-G14
length 19.2 mm 10.06 mm - 8.65 mm 5 mm
Load capacitance (CL) 50 pF 50 pF - 50 pF 50 pF
Logic integrated circuit type AND GATE AND GATE - AND GATE AND GATE
MaximumI(ol) 0.004 A 0.004 A - 0.004 A 0.004 A
Humidity sensitivity level 1 1 - 1 1
Number of functions 4 4 - 4 4
Number of entries 2 2 - 2 2
Number of terminals 14 14 - 14 14
Maximum operating temperature 85 °C 85 °C - 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C - -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP - SOP TSSOP
Encapsulate equivalent code DIP14,.3 SOP14,.3 - SOP14,.25 TSSOP14,.25
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED 260 - 260 260
power supply 2/6 V 2/6 V - 2/6 V 2/6 V
propagation delay (tpd) 115 ns 115 ns - 115 ns 115 ns
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified
Schmitt trigger NO NO - NO NO
Maximum seat height 5.06 mm 2.2 mm - 1.75 mm 1.1 mm
Maximum supply voltage (Vsup) 6 V 6 V - 6 V 6 V
Minimum supply voltage (Vsup) 2 V 2 V - 2 V 2 V
Nominal supply voltage (Vsup) 4.5 V 4.5 V - 4.5 V 4.5 V
surface mount NO YES - YES YES
technology CMOS CMOS - CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL - INDUSTRIAL INDUSTRIAL
Terminal form THROUGH-HOLE GULL WING - GULL WING GULL WING
Terminal pitch 2.54 mm 1.27 mm - 1.27 mm 0.65 mm
Terminal location DUAL DUAL - DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 5.5 mm - 3.95 mm 4.4 mm
method of packing - TAPE AND REEL - TAPE AND REEL TAPE AND REEL
Base Number Matches - 1 - 1 1

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号