|
HD74HC7266FPEL |
HD74HC7266P |
HD74HC7266RPEL |
Description |
Quad. 2-input Exclusive-NOR Gates |
Quad. 2-input Exclusive-NOR Gates |
Quad. 2-input Exclusive-NOR Gates |
Is it lead-free? |
Contains lead |
Lead free |
Contains lead |
Is it Rohs certified? |
incompatible |
conform to |
incompatible |
Maker |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Parts packaging code |
SOIC |
DIP |
SOIC |
package instruction |
5.50 X 10.06 MM, 1.27 MM PITCH, PLASTIC, SOP-14 |
6.30 X 19.20 MM, 2.54 MM PITCH, PLASTIC, DIP-14 |
SOP, SOP14,.25 |
Contacts |
14 |
14 |
14 |
Reach Compliance Code |
unknown |
compliant |
unknow |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
series |
HC/UH |
HC/UH |
HC/UH |
JESD-30 code |
R-PDSO-G14 |
R-PDIP-T14 |
R-PDSO-G14 |
length |
10.06 mm |
19.2 mm |
8.65 mm |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
XNOR GATE |
XNOR GATE |
XNOR GATE |
MaximumI(ol) |
0.004 A |
0.004 A |
0.004 A |
Humidity sensitivity level |
1 |
1 |
1 |
Number of functions |
4 |
4 |
4 |
Number of entries |
2 |
2 |
2 |
Number of terminals |
14 |
14 |
14 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
DIP |
SOP |
Encapsulate equivalent code |
SOP14,.3 |
DIP14,.3 |
SOP14,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
225 |
NOT SPECIFIED |
225 |
power supply |
2/6 V |
2/6 V |
2/6 V |
propagation delay (tpd) |
150 ns |
150 ns |
150 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Schmitt trigger |
NO |
NO |
NO |
Maximum seat height |
2.2 mm |
5.06 mm |
1.75 mm |
Maximum supply voltage (Vsup) |
6 V |
6 V |
6 V |
Minimum supply voltage (Vsup) |
2 V |
2 V |
2 V |
Nominal supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
surface mount |
YES |
NO |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
GULL WING |
THROUGH-HOLE |
GULL WING |
Terminal pitch |
1.27 mm |
2.54 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
5.5 mm |
7.62 mm |
3.95 mm |
method of packing |
TAPE AND REEL |
- |
TAPE AND REEL |
Prop。Delay @ Nom-Sup |
30 ns |
30 ns |
- |
Base Number Matches |
1 |
1 |
- |