ICS8752CY datasheet, PDF - EEWORLD Datasheet

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ICS8752CY: DescriptionPLL Based Clock Driver, 8752 Series, 8 True Output(s), 0 Inverted Output(s), CMOS, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LQFP-32; Categorylogic logic; File Size253KB，14 Pages; ManufacturerIDT (Integrated Device Technology)

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ICS8752CY Overview

PLL Based Clock Driver, 8752 Series, 8 True Output(s), 0 Inverted Output(s), CMOS, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LQFP-32

ICS8752CY Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	QFP
package instruction	LQFP, QFP32,.35SQ,32
Contacts	32
Reach Compliance Code	not_compliant
Other features	ALSO OPERATES AT 3.3V SUPPLY
series	8752
Input adjustment	MUX
JESD-30 code	S-PQFP-G32
JESD-609 code	e0
length	7 mm
Logic integrated circuit type	PLL BASED CLOCK DRIVER
Humidity sensitivity level	3
Number of functions	1
Number of inverted outputs
Number of terminals	32
Actual output times	8
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP32,.35SQ,32
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)	240
power supply	2.5/3.3 V
Certification status	Not Qualified
Same Edge Skew-Max（tskwd）	0.09 ns
Maximum seat height	1.6 mm
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	20
width	7 mm
minfmax	240 MHz
Base Number Matches	1

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Integrated Device Technology, Inc.

6024 Silver Creek Valley Road, San Jose, CA - 95138

PRODUCT/PROCESS CHANGE NOTICE (PCN)

PCN #:

A0610-02

DATE:

16-Oct-2006

MEANS OF DISTINGUISHING CHANGED DEVICES:

Product Mark

Back Mark

Date Code

Other

Attachment:

Samples:

Lot # will have "L" prefix

" prefix

Product Affected:

CABGA, CVBGA, FPBGA, TQFP, PQFP

(See attached affected part # list)

16-Jan-2007

Date Effective:

Contact:

Title:

Phone #:

Fax #:

E-mail:

Geoffrey Cortes

Product Quality Assurance

(408) 284-8321

(408) 284-1450

Geoffrey.Cortes@idt.com

Yes

Please contact your local sales representative for

sample request & availability.

DESCRIPTION AND PURPOSE OF CHANGE:

Die Technology

Wafer Fabrication Process

Assembly Process

Equipment

Material

Testing

Manufacturing Site

Data Sheet

Other

RELIABILITY/QUALIFICATION SUMMARY:

Refer to qualification results shown in attachment I.

CUSTOMER ACKNOWLEDGMENT OF RECEIPT:

IDT records indicate that you require written notification of this change. Please use the acknowledgement below or E-Mail

to grant approval or request additional information. If IDT does not receive acknowledgement within 30 days of this notice

it will be assumed that this change is acceptable.

IDT reserves the right to ship either version manufactured after the process change effective date until the inventory

on the earlier version has been depleted.

Customer:

Name/Date:

Title:

CUSTOMER COMMENTS:

This notification is to advise our customers that IDT has qualified ASAT-China as an

alternate assembly facility for CABGA, CVBGA, FPBGA, TQFP and PQFP packages.

There is no change to the moisture performance of these packages.

Attachment I details the qualification results for this change and Attachment II shows

the affected list of part numbers.

Approval for shipments prior to effective date.

E-Mail Address:

Phone# /Fax# :

IDT ACKNOWLEDGMENT OF RECEIPT:

RECD. BY:

IDT FRA-1509-01 REV. 00 09/18/01

DATE:

Page 1 of 1

Refer To QCA-1795

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