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WE256K32-300G2TMEA

Description
EEPROM Module, 256KX32, 300ns, Parallel, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68
Categorystorage    storage   
File Size261KB,11 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WE256K32-300G2TMEA Overview

EEPROM Module, 256KX32, 300ns, Parallel, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68

WE256K32-300G2TMEA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1546388220
package instructionQFP, QFP68,.99SQ,50
Reach Compliance Codeunknown
Maximum access time300 ns
Other featuresUSER CONFIGURABLE 256K X 32; MINIMUM 10 YEARS DATA RETENTION; WRITE ENDURANCE 10000 CYCLES
Data pollingYES
Data retention time - minimum10
Durability10000 Write/Erase Cycles
JESD-30 codeS-CQFP-G68
JESD-609 codee0
length22.36 mm
memory density8388608 bit
Memory IC TypeEEPROM MODULE
memory width32
Number of functions1
Number of terminals68
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize256KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Encapsulate equivalent codeQFP68,.99SQ,50
Package shapeSQUARE
Package formFLATPACK
page size32 words
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height4.57 mm
Maximum standby current0.009 A
Maximum slew rate0.26 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
switch bitNO
width22.36 mm
write protectSOFTWARE
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