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CY7C1462AV33-250AXCT

Description
ZBT SRAM, 2MX18, 2.6ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, TQFP-100
Categorystorage    storage   
File Size506KB,27 Pages
ManufacturerCypress Semiconductor
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CY7C1462AV33-250AXCT Overview

ZBT SRAM, 2MX18, 2.6ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, TQFP-100

CY7C1462AV33-250AXCT Parametric

Parameter NameAttribute value
Parts packaging codeQFP
package instructionLQFP,
Contacts100
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time2.6 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PQFP-G100
JESD-609 codee3/e4
length20 mm
memory density37748736 bit
Memory IC TypeZBT SRAM
memory width18
Number of functions1
Number of terminals100
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX18
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.63 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMATTE TIN/NICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
width14 mm
Base Number Matches1
CY7C1460AV33
CY7C1462AV33
CY7C1464AV33
36-Mbit (1M x 36/2M x 18/512K x 72)
Pipelined SRAM with NoBL™ Architecture
Features
• Pin-compatible and functionally equivalent to ZBT™
• Supports 250-MHz bus operations with zero wait states
— Available speed grades are 250, 200 and 167 MHz
• Internally self-timed output buffer control to eliminate
the need to use asynchronous OE
• Fully registered (inputs and outputs) for pipelined
operation
• Byte Write capability
• 3.3V power supply
• 3.3V/2.5V I/O power supply
• Fast clock-to-output times
— 2.6 ns (for 250-MHz device)
• Clock Enable (CEN) pin to suspend operation
• Synchronous self-timed writes
• CY7C1460AV33, CY7C1462AV33 available in
JEDEC-standard lead-free 100-pin TQFP, lead-free and
non-lead-free 165-ball FBGA package. CY7C1464AV33
available in lead-free and non-lead-free 209-ball FBGA
package
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• Burst capability—linear or interleaved burst order
• “ZZ” Sleep Mode option and Stop Clock option
Functional Description
The CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 are
3.3V, 1M x 36/2M x 18/512K x72 Synchronous pipelined burst
SRAMs with No Bus Latency™ (NoBL™) logic, respectively.
They are designed to support unlimited true back-to-back
Read/Write operations with no wait states. The
CY7C1460AV33/CY7C1462AV33/CY7C1464AV33
are
equipped with the advanced (NoBL) logic required to enable
consecutive Read/Write operations with data being trans-
ferred on every clock cycle. This feature dramatically improves
the throughput of data in systems that require frequent
Write/Read
transitions.
The
CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 are pin
compatible and functionally equivalent to ZBT devices.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. All data outputs pass through
output registers controlled by the rising edge of the clock. The
clock input is qualified by the Clock Enable (CEN) signal,
which when deasserted suspends operation and extends the
previous clock cycle.
Write operations are controlled by the Byte Write Selects
for
CY7C1464AV33,
BW
a
–BW
d
for
(BW
a
–BW
h
CY7C1460AV33 and BW
a
–BW
b
for CY7C1462AV33) and a
Write Enable (WE) input. All writes are conducted with on-chip
synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. In order to avoid bus
contention, the output drivers are synchronously tri-stated
during the data portion of a write sequence.
Logic Block Diagram-CY7C1460AV33 (1M x 36)
A0, A1, A
MODE
CLK
CEN
ADDRESS
REGISTER 0
A1
A1'
D1
Q1
A0
A0'
BURST
D0
Q0
LOGIC
ADV/LD
C
WRITE ADDRESS
REGISTER 1
WRITE ADDRESS
REGISTER 2
C
ADV/LD
BW
a
BW
b
BW
c
BW
d
WE
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
WRITE
DRIVERS
MEMORY
ARRAY
S
E
N
S
E
A
M
P
S
O
U
T
P
U
T
R
E
G
I
S
T
E
R
S
D
A
T
A
S
T
E
E
R
I
N
G
O
U
T
P
U
T
B
U
F
F
E
R
S
E
DQs
DQP
a
DQP
b
DQP
c
DQP
d
E
INPUT
REGISTER 1
E
INPUT
REGISTER 0
E
OE
CE1
CE2
CE3
ZZ
READ LOGIC
SLEEP
CONTROL
Cypress Semiconductor Corporation
Document #: 38-05353 Rev. *D
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised June 22, 2006
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CY7C1462AV33-250AXCT Related Products

CY7C1462AV33-250AXCT CY7C1462AV33-200AXCT CY7C1460AV33-200BZXI
Description ZBT SRAM, 2MX18, 2.6ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, TQFP-100 ZBT SRAM, 2MX18, 3.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, TQFP-100 ZBT SRAM, 1MX36, 3.2ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-165
Parts packaging code QFP QFP BGA
package instruction LQFP, LQFP, LBGA, BGA165,11X15,40
Contacts 100 100 165
Reach Compliance Code unknown unknown compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 2.6 ns 3.2 ns 3.2 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 code R-PQFP-G100 R-PQFP-G100 R-PBGA-B165
JESD-609 code e3/e4 e3/e4 e1
length 20 mm 20 mm 17 mm
memory density 37748736 bit 37748736 bit 37748736 bit
Memory IC Type ZBT SRAM ZBT SRAM ZBT SRAM
memory width 18 18 36
Number of functions 1 1 1
Number of terminals 100 100 165
word count 2097152 words 2097152 words 1048576 words
character code 2000000 2000000 1000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 85 °C
organize 2MX18 2MX18 1MX36
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP LQFP LBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.4 mm
Maximum supply voltage (Vsup) 3.63 V 3.63 V 3.63 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal surface MATTE TIN/NICKEL PALLADIUM GOLD MATTE TIN/NICKEL PALLADIUM GOLD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form GULL WING GULL WING BALL
Terminal pitch 0.65 mm 0.65 mm 1 mm
Terminal location QUAD QUAD BOTTOM
width 14 mm 14 mm 15 mm
Base Number Matches 1 1 -
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