3.3V/5V 155Mbps PECL LOW POWER LIMITING POST AMPLIFIER W/TTL LOS
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Microchip |
| Parts packaging code | MSOP |
| package instruction | TSSOP, TSSOP10,.19,20 |
| Contacts | 10 |
| Reach Compliance Code | compli |
| app | SONET;SDH |
| JESD-30 code | S-PDSO-G10 |
| JESD-609 code | e0 |
| length | 3 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 10 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP10,.19,20 |
| Package shape | SQUARE |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 3.3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.1 mm |
| Maximum slew rate | 0.042 mA |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| technology | BIPOLAR |
| Telecom integrated circuit types | ATM/SONET/SDH SUPPORT CIRCUIT |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 3 mm |
| Base Number Matches | 1 |
| SY88803VKC | SY88803VKCTR | SY88803V_03 | SY88803VKI | |
|---|---|---|---|---|
| Description | 3.3V/5V 155Mbps PECL LOW POWER LIMITING POST AMPLIFIER W/TTL LOS | 3.3V/5V 155Mbps PECL LOW POWER LIMITING POST AMPLIFIER W/TTL LOS | 3.3V/5V 155Mbps PECL LOW POWER LIMITING POST AMPLIFIER W/TTL LOS | 3.3V/5V 155Mbps PECL LOW POWER LIMITING POST AMPLIFIER W/TTL LOS |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible |
| Maker | Microchip | Microchip | - | Microchip |
| Parts packaging code | MSOP | MSOP | - | MSOP |
| package instruction | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 | - | TSSOP, TSSOP10,.19,20 |
| Contacts | 10 | 10 | - | 10 |
| Reach Compliance Code | compli | compli | - | compli |
| app | SONET;SDH | SONET;SDH | - | SONET;SDH |
| JESD-30 code | S-PDSO-G10 | S-PDSO-G10 | - | S-PDSO-G10 |
| JESD-609 code | e0 | e0 | - | e0 |
| length | 3 mm | 3 mm | - | 3 mm |
| Humidity sensitivity level | 1 | 1 | - | 1 |
| Number of functions | 1 | 1 | - | 1 |
| Number of terminals | 10 | 10 | - | 10 |
| Maximum operating temperature | 85 °C | 85 °C | - | 85 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| encapsulated code | TSSOP | TSSOP | - | TSSOP |
| Encapsulate equivalent code | TSSOP10,.19,20 | TSSOP10,.19,20 | - | TSSOP10,.19,20 |
| Package shape | SQUARE | SQUARE | - | SQUARE |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 240 | 240 | - | 240 |
| power supply | 3.3/5 V | 3.3/5 V | - | 3.3/5 V |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified |
| Maximum seat height | 1.1 mm | 1.1 mm | - | 1.1 mm |
| Maximum slew rate | 0.042 mA | 0.042 mA | - | 0.042 mA |
| Nominal supply voltage | 3.3 V | 3.3 V | - | 3.3 V |
| surface mount | YES | YES | - | YES |
| technology | BIPOLAR | BIPOLAR | - | BIPOLAR |
| Telecom integrated circuit types | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | - | ATM/SONET/SDH SUPPORT CIRCUIT |
| Temperature level | OTHER | OTHER | - | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | - | GULL WING |
| Terminal pitch | 0.5 mm | 0.5 mm | - | 0.5 mm |
| Terminal location | DUAL | DUAL | - | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | - | 30 |
| width | 3 mm | 3 mm | - | 3 mm |
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