AP9A108-12TC datasheet, PDF - EEWORLD Datasheet

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AP9A108-12TC: DescriptionStandard SRAM, 128KX8, 12ns, CMOS, PDSO32, TSOP-32; Categorystorage storage; File Size558KB，9 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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AP9A108-12TC Overview

Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, TSOP-32

AP9A108-12TC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	TSOP-32
Reach Compliance Code	compliant
Maximum access time	12 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
length	18.4 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP32,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.00025 A
Minimum standby current	2 V
Maximum slew rate	0.09 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
width	8 mm
Base Number Matches	1

AP9A108-12TC Related Products

	AP9A108-12TC	AP9A108-12VC	AP9A108-10VC	AP9A108-15TC	AP9A108-15VC	AP9A108-20TC	AP9A108-20VC
Description	Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, TSOP-32	Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, SOJ-32	Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, 0.400 INCH, SOJ-32	Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, TSOP-32	Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.400 INCH, SOJ-32	Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, TSOP-32	Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 0.400 INCH, SOJ-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	TSOP-32	0.400 INCH, SOJ-32	0.400 INCH, SOJ-32	TSOP-32	0.400 INCH, SOJ-32	TSOP-32	0.400 INCH, SOJ-32
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
Maximum access time	12 ns	12 ns	10 ns	15 ns	15 ns	20 ns	20 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDSO-G32	R-PDSO-J32	R-PDSO-J32	R-PDSO-G32	R-PDSO-J32	R-PDSO-G32	R-PDSO-J32
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	18.4 mm	21 mm	21 mm	18.4 mm	21 mm	18.4 mm	21 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	SOJ	SOJ	TSSOP	SOJ	TSSOP	SOJ
Encapsulate equivalent code	TSSOP32,.8,20	SOJ32,.44	SOJ32,.44	TSSOP32,.8,20	SOJ32,.44	TSSOP32,.8,20	SOJ32,.44
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	3.7 mm	3.7 mm	1.2 mm	3.7 mm	1.2 mm	3.7 mm
Maximum standby current	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A
Minimum standby current	2 V	2 V	2 V	2 V	2 V	2 V	2 V
Maximum slew rate	0.09 mA	0.09 mA	0.1 mA	0.085 mA	0.085 mA	0.07 mA	0.07 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	J BEND	J BEND	GULL WING	J BEND	GULL WING	J BEND
Terminal pitch	0.5 mm	1.27 mm	1.27 mm	0.5 mm	1.27 mm	0.5 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	8 mm	10.2 mm	10.2 mm	8 mm	10.2 mm	8 mm	10.2 mm
Maker	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )

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