WF512K32N-70H1M5 datasheet, PDF

WF512K32N-70H1M5: DescriptionFlash Module, 512KX32, 70ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66; Categorystorage storage; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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Flash Module, 512KX32, 70ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	PGA
package instruction	1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Contacts	66
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	70 ns
Other features	USER CONFIGURABLE AS 2M X 8
Spare memory width	16
JESD-30 code	S-CPGA-P66
JESD-609 code	e4
length	27.3 mm
memory density	16777216 bit
Memory IC Type	FLASH MODULE
memory width	32
Number of functions	1
Number of terminals	66
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	4.6 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
type	NOR TYPE
width	27.3 mm
Base Number Matches	1

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