IC,ROM,1MX16/2MX8,CMOS,TSSOP,48PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Reach Compliance Code | unknown |
Maximum access time | 120 ns |
Spare memory width | 8 |
JESD-30 code | R-PDSO-G48 |
JESD-609 code | e0 |
memory density | 16777216 bit |
Memory IC Type | MASK ROM |
memory width | 16 |
Number of terminals | 48 |
word count | 1048576 words |
character code | 1000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | -10 °C |
organize | 1MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSSOP |
Encapsulate equivalent code | TSSOP48,.71,20 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.07 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
UPD23C16000WGY-XXX-MKH | UPD23C16000WG5-XXX-7JF | UPD23C16000WCZ-XXX | UPD23C16000WGX-XXX | UPD23C16000WGY-XXX-MJH | |
---|---|---|---|---|---|
Description | IC,ROM,1MX16/2MX8,CMOS,TSSOP,48PIN,PLASTIC | IC,ROM,1MX16/2MX8,CMOS,TSOP,44PIN,PLASTIC | IC,ROM,1MX16/2MX8,CMOS,DIP,42PIN,PLASTIC | IC,ROM,1MX16/2MX8,CMOS,SOP,44PIN,PLASTIC | IC,ROM,1MX16/2MX8,CMOS,TSSOP,48PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns |
Spare memory width | 8 | 8 | 8 | 8 | 8 |
JESD-30 code | R-PDSO-G48 | R-PDSO-G44 | R-PDIP-T42 | R-PDSO-G44 | R-PDSO-G48 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
memory density | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
memory width | 16 | 16 | 16 | 16 | 16 |
Number of terminals | 48 | 44 | 42 | 44 | 48 |
word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
Minimum operating temperature | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C |
organize | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TSSOP | TSOP | DIP | SOP | TSSOP |
Encapsulate equivalent code | TSSOP48,.71,20 | TSOP44,.46,32 | DIP42,.6 | SOP44,.63 | TSSOP48,.71,20 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
Maximum slew rate | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | NO | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
Terminal pitch | 0.5 mm | 0.8 mm | 2.54 mm | 1.27 mm | 0.5 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
Maker | - | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |