Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDIP16, 0.300 INCH, PLASTIC, MS-001, DIP-16
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Parts packaging code | DIP |
package instruction | DIP, DIP16,.3 |
Contacts | 16 |
Reach Compliance Code | compliant |
Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER |
JESD-30 code | R-PDIP-T16 |
JESD-609 code | e3 |
length | 19.305 mm |
Maximum negative supply voltage (Vsup) | |
Negative supply voltage minimum (Vsup) | |
Nominal Negative Supply Voltage (Vsup) | |
Number of channels | 8 |
Number of functions | 1 |
Number of terminals | 16 |
On-state resistance matching specifications | 10 Ω |
Maximum on-state resistance (Ron) | 1050 Ω |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT APPLICABLE |
power supply | 5/15 V |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 15 V |
Minimum supply voltage (Vsup) | 5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
Maximum disconnect time | 420 ns |
Maximum connection time | 1200 ns |
switch | BREAK-BEFORE-MAKE |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Matte Tin (Sn) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT APPLICABLE |
width | 7.62 mm |
Base Number Matches | 1 |
CD4051BCN_NL | CD4052BCMX_NL | CD4053BCMX_NL | CD4051BCMX_NL | |
---|---|---|---|---|
Description | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDIP16, 0.300 INCH, PLASTIC, MS-001, DIP-16 | Differential Multiplexer, 1 Func, 4 Channel, CMOS, PDSO16, 0.150 INCH, MS-012, SOIC-16 | Single-Ended Multiplexer, 3 Func, 2 Channel, CMOS, PDSO16, 0.150 INCH, MS-012, SOIC-16 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDSO16, 0.150 INCH, MS-012, SOIC-16 |
Is it Rohs certified? | conform to | conform to | conform to | conform to |
Parts packaging code | DIP | SOIC | SOIC | SOIC |
package instruction | DIP, DIP16,.3 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 |
Contacts | 16 | 16 | 16 | 16 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 code | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609 code | e3 | e3 | e3 | e3 |
length | 19.305 mm | 9.9 mm | 9.9 mm | 9.9 mm |
Number of channels | 8 | 4 | 2 | 8 |
Number of functions | 1 | 1 | 3 | 1 |
Number of terminals | 16 | 16 | 16 | 16 |
On-state resistance matching specifications | 10 Ω | 10 Ω | 10 Ω | 10 Ω |
Maximum on-state resistance (Ron) | 1050 Ω | 1050 Ω | 1050 Ω | 1050 Ω |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | SOP | SOP |
Encapsulate equivalent code | DIP16,.3 | SOP16,.25 | SOP16,.25 | SOP16,.25 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT APPLICABLE | 260 | 260 | 260 |
power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 1.75 mm | 1.75 mm | 1.75 mm |
Maximum supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V |
Minimum supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES | YES |
Maximum disconnect time | 420 ns | 420 ns | 420 ns | 420 ns |
Maximum connection time | 1200 ns | 1200 ns | 1200 ns | 1200 ns |
switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT APPLICABLE | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm |
Humidity sensitivity level | - | 1 | 1 | 1 |