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WS512K32L-25H1MA

Description
SRAM Module, 512KX32, 25ns, CMOS, CHIP66, CERAMIC, HIP-66
Categorystorage    storage   
File Size609KB,11 Pages
ManufacturerWhite Microelectronics
Download Datasheet Parametric View All

WS512K32L-25H1MA Overview

SRAM Module, 512KX32, 25ns, CMOS, CHIP66, CERAMIC, HIP-66

WS512K32L-25H1MA Parametric

Parameter NameAttribute value
package instructionCERAMIC, HIP-66
Reach Compliance Codeunknown
Maximum access time25 ns
Other featuresUSER CONFIGURABLE AS 2M X 8
Spare memory width16
JESD-30 codeS-CHIP-P66
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals66
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeSQUARE
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formPIN/PEG
Terminal locationHEX
Base Number Matches1
WS512K32-XXX
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES
n
Access Times of 15*, 17, 20, 25, 35, 45, 55ns
n
Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
(Package 400).
• 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm (0.140")
(Package 502)
1
, Package to be developed.
• 68 lead, Hermetic CQFP (G2T)
1
, 22.4mm (0.880") square
(Package 509) 4.57mm (0.180") height.
Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3).
• 68 lead, Hermetic CQFP (G1U), 23.9mm (0.940") square
(Package 519) 3.57mm (0.140") height.
Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3).
• 68 lead, Hermetic CQFP (G1U), 23.9mm (0.940") square
(Package 524) 4.06mm (0.160") height.
n
Organized as 512Kx32, User Configurable as 1Mx16 or 2Mx8
n
Commercial, Industrial and Military Temperature Ranges
n
TTL Compatible Inputs and Outputs
n
5 Volt Power Supply
n
Low Power CMOS
n
Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
n
Weight
WS512K32-XH1X - 13 grams typical
WS512K32-XG2TX
1
- 8 grams typical
WS512K32-XG1UX - 5 grams typical
WS512K32-XG1TX - 5 grams typical
WS512K32-XG4TX
1
- 20 grams typical
* 15ns Access Time available only in Commercial and Industrial Temperature.
This speed is not fully characterized and is subject to change without notice.
Note 1: Package Not Recommended For New Design
FIG. 1
PIN CONFIGURATION FOR WS512K32N-XH1X
TOP VIEW
PIN DESCRIPTION
I/O
0-31
A
0-18
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
November 2001 Rev. 9
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

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