Flash Module, 512KX8, 150ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| Reach Compliance Code | unknown |
| Maximum access time | 150 ns |
| Other features | CONFIGURABLE AS 128K X 32 |
| Spare memory width | 16 |
| Data polling | NO |
| JESD-30 code | S-CPGA-P66 |
| JESD-609 code | e0 |
| length | 27.3 mm |
| memory density | 4194304 bit |
| Memory IC Type | FLASH MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 66 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 512KX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | PGA |
| Encapsulate equivalent code | PGA66,11X11 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Programming voltage | 12 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.34 mm |
| Maximum standby current | 0.0065 A |
| Maximum slew rate | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| switch bit | NO |
| type | NOR TYPE |
| width | 27.3 mm |
| Base Number Matches | 1 |
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