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K8S1315EBC-FC1C0

Description
Flash, 32MX16, 100ns, PBGA64, 9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-64
Categorystorage    storage   
File Size667KB,83 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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K8S1315EBC-FC1C0 Overview

Flash, 32MX16, 100ns, PBGA64, 9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-64

K8S1315EBC-FC1C0 Parametric

Parameter NameAttribute value
Parts packaging codeBGA
package instructionVFBGA,
Contacts64
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time100 ns
Other featuresBOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
startup blockBOTTOM
JESD-30 codeR-PBGA-B64
memory density536870912 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals64
word count33554432 words
character code32000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32MX16
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height1 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
typeNOR TYPE
Base Number Matches1

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