AT27C1024-70JJ datasheet, PDF - EEWORLD Datasheet

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AT27C1024-70JJ: DescriptionOTP ROM, 64KX16, 70ns, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44; Categorystorage storage; File Size356KB，14 Pages; ManufacturerAtmel (Microchip); Environmental Compliance

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AT27C1024-70JJ Overview

OTP ROM, 64KX16, 70ns, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44

AT27C1024-70JJ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	LPCC
package instruction	QCCJ,
Contacts	44
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	70 ns
JESD-30 code	S-PQCC-J44
JESD-609 code	e3
length	16.586 mm
memory density	1048576 bit
Memory IC Type	OTP ROM
memory width	16
Humidity sensitivity level	2
Number of functions	1
Number of terminals	44
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	245
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	16.586 mm
Base Number Matches	1

AT27C1024-70JJ Related Products

	AT27C1024-70JJ	AT27C1024-45PJ	AT27C1024-45JJ	AT27C1024-70VJ	AT27C1024-70PJ	AT27C1024-45VJ
Description	OTP ROM, 64KX16, 70ns, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44	OTP ROM, 64KX16, 45ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, MS-011AC, DIP-40	OTP ROM, 64KX16, 45ns, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44	OTP ROM, 64KX16, 70ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, MO-142CA, VSOP1-40	OTP ROM, 64KX16, 70ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, MS-011AC, DIP-40	OTP ROM, 64KX16, 45ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, MO-142CA, VSOP1-40
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	LPCC	DIP	LPCC	TSOP1	DIP	TSOP1
package instruction	QCCJ,	DIP,	QCCJ,	TSOP1,	DIP,	TSOP1,
Contacts	44	40	44	40	40	40
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	70 ns	45 ns	45 ns	70 ns	70 ns	45 ns
JESD-30 code	S-PQCC-J44	R-PDIP-T40	S-PQCC-J44	R-PDSO-G40	R-PDIP-T40	R-PDSO-G40
JESD-609 code	e3	e3	e3	e3	e3	e3
length	16.586 mm	52.324 mm	16.586 mm	12.4 mm	52.324 mm	12.4 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	16	16	16	16	16	16
Humidity sensitivity level	2	1	2	3	1	3
Number of functions	1	1	1	1	1	1
Number of terminals	44	40	44	40	40	40
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	DIP	QCCJ	TSOP1	DIP	TSOP1
Package shape	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE	IN-LINE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	245	260	245	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.572 mm	4.826 mm	4.572 mm	1.2 mm	4.826 mm	1.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN
Terminal form	J BEND	THROUGH-HOLE	J BEND	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	0.5 mm	2.54 mm	0.5 mm
Terminal location	QUAD	DUAL	QUAD	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	40	30	40	40	30	40
width	16.586 mm	15.24 mm	16.586 mm	10 mm	15.24 mm	10 mm
Output characteristics	3-STATE	-	3-STATE	3-STATE	-	3-STATE
Maker	-	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)

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