MAX4178ESA+放大器基础信息:
MAX4178ESA+是一款BUFFER。常用的包装方式为0.150 INCH, SOIC-8
MAX4178ESA+放大器核心信息:
MAX4178ESA+的最低工作温度是-40 °C,最高工作温度是85 °C。其峰值回流温度为26025℃下的最大偏置电流为:3 µA他的最大平均偏置电流为5 µA
如何简单看一个放大器效率?看它的压摆率,MAX4178ESA+的标称压摆率有1300 V/us。厂商给出的MAX4178ESA+的最大压摆率为12 mA,而最小压摆率为1000 V/us。而在运放闭环使用时,某个指定闭环增益(一般为 1 或者 2、 10 等)下,MAX4178ESA+增益变为低频增益的 0.707 倍时的频率为330 MHz。
MAX4178ESA+的标称供电电压为5 V,其对应的标称负供电电压为-5 V。MAX4178ESA+的输入失调电压为3000 µV(输入失调电压:使运算放大器输出端为0V(或接近0V)所需加于两输入端之间的补偿电压。)
MAX4178ESA+的相关尺寸:
MAX4178ESA+的宽度为:3.9 mm,长度为4.9 mmMAX4178ESA+拥有8个端子.其端子位置类型为:DUAL。端子节距为1.27 mm。共有针脚:8
MAX4178ESA+放大器其他信息:
其温度等级为:INDUSTRIAL。而其湿度敏感等级为:1。MAX4178ESA+不符合Rohs认证。其对应的的JESD-30代码为:R-PDSO-G8。其对应的的JESD-609代码为:e3。
MAX4178ESA+的封装代码是:SOP。MAX4178ESA+封装的材料多为PLASTIC/EPOXY。而其封装形状为RECTANGULAR。MAX4178ESA+封装引脚的形式有:SMALL OUTLINE。其端子形式有:GULL WING。
座面最大高度为1.75 mm。
MAX4178ESA+放大器基础信息:
MAX4178ESA+是一款BUFFER。常用的包装方式为0.150 INCH, SOIC-8
MAX4178ESA+放大器核心信息:
MAX4178ESA+的最低工作温度是-40 °C,最高工作温度是85 °C。其峰值回流温度为26025℃下的最大偏置电流为:3 µA他的最大平均偏置电流为5 µA
如何简单看一个放大器效率?看它的压摆率,MAX4178ESA+的标称压摆率有1300 V/us。厂商给出的MAX4178ESA+的最大压摆率为12 mA,而最小压摆率为1000 V/us。而在运放闭环使用时,某个指定闭环增益(一般为 1 或者 2、 10 等)下,MAX4178ESA+增益变为低频增益的 0.707 倍时的频率为330 MHz。
MAX4178ESA+的标称供电电压为5 V,其对应的标称负供电电压为-5 V。MAX4178ESA+的输入失调电压为3000 µV(输入失调电压:使运算放大器输出端为0V(或接近0V)所需加于两输入端之间的补偿电压。)
MAX4178ESA+的相关尺寸:
MAX4178ESA+的宽度为:3.9 mm,长度为4.9 mmMAX4178ESA+拥有8个端子.其端子位置类型为:DUAL。端子节距为1.27 mm。共有针脚:8
MAX4178ESA+放大器其他信息:
其温度等级为:INDUSTRIAL。而其湿度敏感等级为:1。MAX4178ESA+不符合Rohs认证。其对应的的JESD-30代码为:R-PDSO-G8。其对应的的JESD-609代码为:e3。
MAX4178ESA+的封装代码是:SOP。MAX4178ESA+封装的材料多为PLASTIC/EPOXY。而其封装形状为RECTANGULAR。MAX4178ESA+封装引脚的形式有:SMALL OUTLINE。其端子形式有:GULL WING。
座面最大高度为1.75 mm。
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Parts packaging code | SOIC |
package instruction | 0.150 INCH, SOIC-8 |
Contacts | 8 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Amplifier type | BUFFER |
Maximum average bias current (IIB) | 5 µA |
Nominal bandwidth (3dB) | 330 MHz |
Maximum bias current (IIB) at 25C | 3 µA |
Maximum input offset voltage | 3000 µV |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e3 |
length | 4.9 mm |
Humidity sensitivity level | 1 |
Negative supply voltage upper limit | -6 V |
Nominal Negative Supply Voltage (Vsup) | -5 V |
Number of functions | 1 |
Number of terminals | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Minimum output current | 0.1 A |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 |
power supply | +-5 V |
Certification status | Not Qualified |
Maximum seat height | 1.75 mm |
minimum slew rate | 1000 V/us |
Nominal slew rate | 1300 V/us |
Maximum slew rate | 12 mA |
Supply voltage upper limit | 6 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 3.9 mm |
Base Number Matches | 1 |
MAX4178ESA+ | MAX4178EUK+ | MAX4178ESA+T | |
---|---|---|---|
Description | Buffer Amplifier, 1 Func, CMOS, PDSO8, 0.150 INCH, SOIC-8 | Buffer Amplifier, 1 Func, PDSO5, SOT-23, 5 PIN | Buffer Amplifier, 1 Func, CMOS, PDSO8, 0.150 INCH, SOIC-8 |
Is it Rohs certified? | conform to | conform to | conform to |
Parts packaging code | SOIC | SOT-23 | SOIC |
package instruction | 0.150 INCH, SOIC-8 | LSSOP, | SOP, SOP8,.25 |
Contacts | 8 | 5 | 8 |
Reach Compliance Code | unknown | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 |
Amplifier type | BUFFER | BUFFER | BUFFER |
Maximum average bias current (IIB) | 5 µA | 5 µA | 5 µA |
Nominal bandwidth (3dB) | 330 MHz | 330 MHz | 330 MHz |
Maximum input offset voltage | 3000 µV | 5000 µV | 3000 µV |
JESD-30 code | R-PDSO-G8 | R-PDSO-G5 | R-PDSO-G8 |
JESD-609 code | e3 | e3 | e3 |
length | 4.9 mm | 2.9 mm | 4.9 mm |
Humidity sensitivity level | 1 | 1 | 1 |
Negative supply voltage upper limit | -6 V | -6 V | -6 V |
Nominal Negative Supply Voltage (Vsup) | -5 V | -5 V | -5 V |
Number of functions | 1 | 1 | 1 |
Number of terminals | 8 | 5 | 8 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C |
Minimum output current | 0.1 A | 0.1 A | 0.1 A |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | LSSOP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.75 mm | 1.45 mm | 1.75 mm |
Supply voltage upper limit | 6 V | 6 V | 6 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
Terminal form | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 0.95 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 30 | 30 | NOT SPECIFIED |
width | 3.9 mm | 1.625 mm | 3.9 mm |
Maximum bias current (IIB) at 25C | 3 µA | - | 3 µA |
Encapsulate equivalent code | SOP8,.25 | - | SOP8,.25 |
power supply | +-5 V | - | +-5 V |
minimum slew rate | 1000 V/us | - | 1000 V/us |
Nominal slew rate | 1300 V/us | - | 1300 V/us |
Maximum slew rate | 12 mA | - | 12 mA |
technology | CMOS | - | CMOS |
Maker | - | Maxim | Maxim |