IC,SYNC SRAM,256KX18,CMOS,QFP,100PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | QFP, QFP100,.63X.87 |
Reach Compliance Code | unknown |
Maximum access time | 3.5 ns |
Maximum clock frequency (fCLK) | 166 MHz |
I/O type | COMMON |
JESD-30 code | R-PQFP-G100 |
JESD-609 code | e0 |
memory density | 4718592 bit |
Memory IC Type | STANDARD SRAM |
memory width | 18 |
Number of terminals | 100 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX18 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Encapsulate equivalent code | QFP100,.63X.87 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
power supply | 2.5/3.3,3.3 V |
Certification status | Not Qualified |
Maximum standby current | 0.045 A |
Minimum standby current | 3.14 V |
Maximum slew rate | 0.425 mA |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.635 mm |
Terminal location | QUAD |
Base Number Matches | 1 |
MCM69P819TQ3.5 | |
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Description | IC,SYNC SRAM,256KX18,CMOS,QFP,100PIN,PLASTIC |
Is it Rohs certified? | incompatible |
package instruction | QFP, QFP100,.63X.87 |
Reach Compliance Code | unknown |
Maximum access time | 3.5 ns |
Maximum clock frequency (fCLK) | 166 MHz |
I/O type | COMMON |
JESD-30 code | R-PQFP-G100 |
JESD-609 code | e0 |
memory density | 4718592 bit |
Memory IC Type | STANDARD SRAM |
memory width | 18 |
Number of terminals | 100 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
organize | 256KX18 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Encapsulate equivalent code | QFP100,.63X.87 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
power supply | 2.5/3.3,3.3 V |
Certification status | Not Qualified |
Maximum standby current | 0.045 A |
Minimum standby current | 3.14 V |
Maximum slew rate | 0.425 mA |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.635 mm |
Terminal location | QUAD |
Base Number Matches | 1 |