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MCM69P819TQ3.5

Description
IC,SYNC SRAM,256KX18,CMOS,QFP,100PIN,PLASTIC
Categorystorage    storage   
File Size1007KB,18 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MCM69P819TQ3.5 Overview

IC,SYNC SRAM,256KX18,CMOS,QFP,100PIN,PLASTIC

MCM69P819TQ3.5 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionQFP, QFP100,.63X.87
Reach Compliance Codeunknown
Maximum access time3.5 ns
Maximum clock frequency (fCLK)166 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee0
memory density4718592 bit
Memory IC TypeSTANDARD SRAM
memory width18
Number of terminals100
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum standby current0.045 A
Minimum standby current3.14 V
Maximum slew rate0.425 mA
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationQUAD
Base Number Matches1

MCM69P819TQ3.5 Related Products

MCM69P819TQ3.5
Description IC,SYNC SRAM,256KX18,CMOS,QFP,100PIN,PLASTIC
Is it Rohs certified? incompatible
package instruction QFP, QFP100,.63X.87
Reach Compliance Code unknown
Maximum access time 3.5 ns
Maximum clock frequency (fCLK) 166 MHz
I/O type COMMON
JESD-30 code R-PQFP-G100
JESD-609 code e0
memory density 4718592 bit
Memory IC Type STANDARD SRAM
memory width 18
Number of terminals 100
word count 262144 words
character code 256000
Operating mode SYNCHRONOUS
Maximum operating temperature 70 °C
organize 256KX18
Output characteristics 3-STATE
Package body material PLASTIC/EPOXY
encapsulated code QFP
Encapsulate equivalent code QFP100,.63X.87
Package shape RECTANGULAR
Package form FLATPACK
Parallel/Serial PARALLEL
power supply 2.5/3.3,3.3 V
Certification status Not Qualified
Maximum standby current 0.045 A
Minimum standby current 3.14 V
Maximum slew rate 0.425 mA
surface mount YES
technology CMOS
Temperature level COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb)
Terminal form GULL WING
Terminal pitch 0.635 mm
Terminal location QUAD
Base Number Matches 1

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