|
EDI2CG472256V12D1 |
EDI2CG472256V9D1 |
EDI2CG472256V10D1 |
Description |
SRAM Module, 2MX8, 12ns, CMOS, |
SRAM Module, 2MX8, 9ns, CMOS, |
SRAM Module, 2MX8, 10ns, CMOS, |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
Reach Compliance Code |
unknown |
unknown |
unknown |
Maximum access time |
12 ns |
9 ns |
10 ns |
Other features |
CONFIGURABLE AS 256K X 64 |
CONFIGURABLE AS 256K X 64 |
CONFIGURABLE AS 256K X 64 |
JESD-30 code |
R-XDMA-N144 |
R-XDMA-N144 |
R-XDMA-N144 |
memory density |
16777216 bit |
16777216 bit |
16777216 bit |
Memory IC Type |
SRAM MODULE |
SRAM MODULE |
SRAM MODULE |
memory width |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
Number of terminals |
144 |
144 |
144 |
word count |
2097152 words |
2097152 words |
2097152 words |
character code |
2000000 |
2000000 |
2000000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
organize |
2MX8 |
2MX8 |
2MX8 |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
3.14 V |
3.14 V |
3.14 V |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
surface mount |
NO |
NO |
NO |
technology |
CMOS |
CMOS |
CMOS |
Terminal form |
NO LEAD |
NO LEAD |
NO LEAD |
Terminal location |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Base Number Matches |
1 |
1 |
- |
Maker |
- |
White Electronic Designs Corporation |
White Electronic Designs Corporation |