TELECOM-SLIC, PQCC28, PLASTIC, LCC-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | QLCC |
| package instruction | PLASTIC, LCC-28 |
| Contacts | 28 |
| Reach Compliance Code | not_compliant |
| battery fed | RESISTIVE |
| Battery powered | -24 V |
| mix | 2-4 CONVERSION |
| JESD-30 code | S-PQCC-J28 |
| JESD-609 code | e0 |
| length | 11.505 mm |
| Number of functions | 1 |
| Number of terminals | 28 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PSRR-Min | 20 dB |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC28,.5SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Maximum slew rate | 0.006 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Telecom integrated circuit types | SLIC |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 11.505 mm |
| Base Number Matches | 1 |
| HC5517IM96 | HC5517CB96 | HC5517CM96 | HC5517IB96 | |
|---|---|---|---|---|
| Description | TELECOM-SLIC, PQCC28, PLASTIC, LCC-28 | TELECOM-SLIC, PDSO28 | TELECOM-SLIC, PQCC28, PLASTIC, LCC-28 | TELECOM-SLIC, PDSO28 |
| package instruction | PLASTIC, LCC-28 | SOIC-28 | PLASTIC, LCC-28 | , |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | unknown |
| JESD-30 code | S-PQCC-J28 | R-PDSO-G28 | S-PQCC-J28 | R-PDSO-G28 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 |
| Maximum operating temperature | 85 °C | 75 °C | 75 °C | 85 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | CHIP CARRIER | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 0.006 mA | 6 mA | 0.006 mA | 6 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES |
| Telecom integrated circuit types | SLIC | SLIC | SLIC | SLIC |
| Temperature level | INDUSTRIAL | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | INDUSTRIAL |
| Terminal form | J BEND | GULL WING | J BEND | GULL WING |
| Terminal location | QUAD | DUAL | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | - |
| Parts packaging code | QLCC | SOIC | QLCC | - |
| Contacts | 28 | 28 | 28 | - |
| battery fed | RESISTIVE | RESISTIVE | RESISTIVE | - |
| Battery powered | -24 V | -24 V | -24 V | - |
| mix | 2-4 CONVERSION | 2-4 CONVERSION | 2-4 CONVERSION | - |
| JESD-609 code | e0 | e0 | e0 | - |
| PSRR-Min | 20 dB | 20 dB | 20 dB | - |
| encapsulated code | QCCJ | SOP | QCCJ | - |
| Encapsulate equivalent code | LDCC28,.5SQ | SOP28,.4 | LDCC28,.5SQ | - |
| power supply | 5 V | 5 V | 5 V | - |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | - |
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